Search Results - Changqing Liu

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  1. 1
    Phase field study of grain boundary migration and preferential growth in non-magnetic materials under magnetic field

    Phase field study of grain boundary migration and preferential growth in non-magnetic materials under magnetic field by Shuibao Liang, Changqing Liu, Zhaoxia Zhou

    Published 2022
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  2. 2
    Thermal stability of high temperature Pb-free solder interconnect characterised by in-situ electron microscopy

    Thermal stability of high temperature Pb-free solder interconnect characterised by in-situ electron microscopy by Zhaoxia Zhou, Li Liu, Changqing Liu

    Published 2018
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  3. 3
    Magnetic deposition of Ni/Au coated polymer core particles for flip-chip interconnection

    Magnetic deposition of Ni/Au coated polymer core particles for flip-chip interconnection by Junlei Tao, David Whalley, Changqing Liu

    Published 2014
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  4. 4
    A scalable engineering approach to improve performance of a miniaturized optical detection system for in vitro point-of-care testing

    A scalable engineering approach to improve performance of a miniaturized optical detection system for in vitro point-of-care testing by Hannah Robbins, Sijung Hu, Changqing Liu

    Published 2015
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  5. 5
    Direct-write techniques for maskless production of microelectronics: a review of current state-of-the-art technologies

    Direct-write techniques for maskless production of microelectronics: a review of current state-of-the-art technologies by Yan Zhang, Changqing Liu, David Whalley

    Published 2009
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  6. 6
    The effect of co-planarity variation on anisotropic conductive adhesive assemblies

    The effect of co-planarity variation on anisotropic conductive adhesive assemblies by Guangbin Dou, David Whalley, Changqing Liu

    Published 2006
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  7. 7
    Effect of thermal aging on interfacial behaviour of copper ball bonds

    Effect of thermal aging on interfacial behaviour of copper ball bonds by Hui Xu, Changqing Liu, Vadim Silberschmidt

    Published 2008
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  8. 8
    Electrical conduction characteristics of solid metal anisotropic conductive adhesive particles

    Electrical conduction characteristics of solid metal anisotropic conductive adhesive particles by Guangbin Dou, David Whalley, Changqing Liu

    Published 2004
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  9. 9
    Mechanical response of indium micro-joints to low temperature cycling

    Mechanical response of indium micro-joints to low temperature cycling by X. Cheng, Changqing Liu, Vadim Silberschmidt

    Published 2009
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  10. 10
    Mechanical and electrical characterisation of individual ACA conductor particles

    Mechanical and electrical characterisation of individual ACA conductor particles by Guangbin Dou, David Whalley, Changqing Liu

    Published 2006
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  11. 11
    Deformation property measurement for single anisotropic conductive adhesive particles

    Deformation property measurement for single anisotropic conductive adhesive particles by Guangbin Dou, David Whalley, Changqing Liu

    Published 2006
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  12. 12
    The effect of droplet ejection frequency on the dimensions of inkjet-etched micro-via holes in poly4(-vinyl phenol) thin films

    The effect of droplet ejection frequency on the dimensions of inkjet-etched micro-via holes in poly4(-vinyl phenol) thin films by Yan Zhang, Changqing Liu, David Whalley

    Published 2012
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  13. 13
    Mechanical characterization of individual Ni/Au coated microsize polymer particles

    Mechanical characterization of individual Ni/Au coated microsize polymer particles by Guangbin Dou, David Whalley, Changqing Liu

    Published 2008
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  14. 14
    The thermal stability of alkanethiol self-assembled monolayers on copper for fluxless soldering applications

    The thermal stability of alkanethiol self-assembled monolayers on copper for fluxless soldering applications by Stephen Ebbens, David Hutt, Changqing Liu

    Published 2010
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  15. 15
    The impact of substrate temperature on the size and aspect ratio of inkjet-dissolved via holes in thin poly(4-vinyl phenol) dielectric layers

    The impact of substrate temperature on the size and aspect ratio of inkjet-dissolved via holes in thin poly(4-vinyl phenol) dielectric layers by Yan Zhang, Changqing Liu, David Whalley

    Published 2013
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  16. 16
    Numerical analysis of thermo-mechanical behavior of indium micro-joint at cryogenic temperatures

    Numerical analysis of thermo-mechanical behavior of indium micro-joint at cryogenic temperatures by X. Cheng, Changqing Liu, Vadim Silberschmidt

    Published 2012
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  17. 17
    Corrosion characterization of tin–lead and lead-free solders in 3.5 wt.% NaCl solution

    Corrosion characterization of tin–lead and lead-free solders in 3.5 wt.% NaCl solution by Dezhi Li, Paul Conway, Changqing Liu

    Published 2008
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  18. 18
    The penetration limit of poly(4-vinyl phenol) thin films for etching via holes by inkjet printing

    The penetration limit of poly(4-vinyl phenol) thin films for etching via holes by inkjet printing by Yan Zhang, Changqing Liu, David Whalley

    Published 2012
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  19. 19
    A mechanism of the penetration limit for producing holes in poly(4-vinyl phenol) films by inkjet etching

    A mechanism of the penetration limit for producing holes in poly(4-vinyl phenol) films by inkjet etching by Yan Zhang, Changqing Liu, David Whalley

    Published 2015
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  20. 20
    Influence of etching solvent evaporation on the size of micro-via holes in PVP thin films

    Influence of etching solvent evaporation on the size of micro-via holes in PVP thin films by Yan Zhang, Changqing Liu, David C. Whalley

    Published 2012
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  21. 21
    Fine pitch printing on a non-woven fabric for high frequency applications

    Fine pitch printing on a non-woven fabric for high frequency applications by Ying Ying Lim, Yee Goh, Changqing Liu

    Published 2013
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  22. 22
    Electrical conductive, characteristics of ACA bonding: a review of the literature, current challenges and future prospects.

    Electrical conductive, characteristics of ACA bonding: a review of the literature, current challenges and future prospects. by Guangbin Dou, David C. Whalley, Changqing Liu

    Published 2004
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  23. 23
    Surface treatments for inkjet printing onto a PTFE-based substrate for high frequency applications

    Surface treatments for inkjet printing onto a PTFE-based substrate for high frequency applications by Ying Ying Lim, Yee Goh, Changqing Liu

    Published 2013
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  24. 24
    Perpendicular growth characteristics of Cu-Sn intermetallic compounds at the surface of Sn99Cu1/Cu solder interconnects

    Perpendicular growth characteristics of Cu-Sn intermetallic compounds at the surface of Sn99Cu1/Cu solder interconnects by Zhiwen Chen, Changqing Liu, Yiping Wu, Bing An

    Published 2015
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  25. 25
    Transient liquid phase bonding with Ga-based alloys for electronics interconnections

    Transient liquid phase bonding with Ga-based alloys for electronics interconnections by Yi Chen, Canyu Liu, Zhaoxia Zhou, Changqing Liu

    Published 2022
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  26. 26
    Interfacial intermetallic compounds growth kinetics and mechanical characteristics of Ga-Cu interconnects prepared via transient liquid phase bonding

    Interfacial intermetallic compounds growth kinetics and mechanical characteristics of Ga-Cu interconnects prepared via transient liquid phase bonding by Yi Chen, Han Jiang, Zhaoxia Zhou, Changqing Liu

    Published 2024
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  27. 27
    Mechanical behaviour of grains in SnAgCu solder joints

    Mechanical behaviour of grains in SnAgCu solder joints by Jicheng Gong, Changqing Liu, Paul Conway, Vadim Silberschmidt

    Published 2006
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  28. 28
    Stability of Ni3P and its effect on the interfacial reaction between electroless Ni-P and molten tin

    Stability of Ni3P and its effect on the interfacial reaction between electroless Ni-P and molten tin by Keming Chen, Changqing Liu, David Whalley, David Hutt

    Published 2005
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  29. 29
    TEM microstructural analysis of as-bonded copper ball bonds on aluminum metallization

    TEM microstructural analysis of as-bonded copper ball bonds on aluminum metallization by Hui Xu, Changqing Liu, Vadim Silberschmidt, Zhong Chen

    Published 2008
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  30. 30
    Grain features of SnAgCu solder and their effect on mechanical behaviour of micro-joints

    Grain features of SnAgCu solder and their effect on mechanical behaviour of micro-joints by Jicheng Gong, Changqing Liu, Paul Conway, Vadim Silberschmidt

    Published 2006
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  31. 31
    Crystallographic structure and mechanical behaviour of SnAgCu solder interconnects under a constant loading rate

    Crystallographic structure and mechanical behaviour of SnAgCu solder interconnects under a constant loading rate by Jicheng Gong, Changqing Liu, Paul Conway, Vadim Silberschmidt

    Published 2007
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  32. 32
    Effects of process parameters on bondability in thermosonic copper ball bonding

    Effects of process parameters on bondability in thermosonic copper ball bonding by Hui Xu, Changqing Liu, Vadim Silberschmidt, Honghui Wang

    Published 2008
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  33. 33
    Formation of Sn dendrites and SnAg eutectics in a SnAgCu solder

    Formation of Sn dendrites and SnAg eutectics in a SnAgCu solder by Jicheng Gong, Changqing Liu, Paul Conway, Vadim Silberschmidt

    Published 2009
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  34. 34
    Mesomechanical modelling of SnAgCu solder joints in flip chip

    Mesomechanical modelling of SnAgCu solder joints in flip chip by Jicheng Gong, Changqing Liu, Paul Conway, Vadim Silberschmidt

    Published 2008
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  35. 35
    Epoxy adhesive behaviour on ceramic surfaces in commercial optoelectronic assemblies

    Epoxy adhesive behaviour on ceramic surfaces in commercial optoelectronic assemblies by Owain Williams, Changqing Liu, Patrick Webb, P. Firth

    Published 2010
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  36. 36
    Microstructural and mechanical analysis on Cu-Sn intermetallic micro-joints under isothermal condition

    Microstructural and mechanical analysis on Cu-Sn intermetallic micro-joints under isothermal condition by Liping Mo, Zhichao Chen, Fengshun Wu, Changqing Liu

    Published 2015
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  37. 37
    Surface modification of an ambient UV-cured dielectric to realise electrically conducting traces

    Surface modification of an ambient UV-cured dielectric to realise electrically conducting traces by Ying Lim, Yee Goh, Changqing Liu, David Hutt

    Published 2015
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  38. 38
    Mechanical and electrical characterisation of Au wire interconnects in electronic packages under the combined vibration and thermal testing conditions

    Mechanical and electrical characterisation of Au wire interconnects in electronic packages under the combined vibration and thermal testing conditions by Maria Mirgkizoudi, Changqing Liu, Paul Conway, Steve Riches

    Published 2015
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  39. 39
    Formation of Ag3Sn plates in SnAgCu solder bumps

    Formation of Ag3Sn plates in SnAgCu solder bumps by Jicheng Gong, Changqing Liu, Paul Conway, Vadim Silberschmidt

    Published 2010
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  40. 40
    Study of height reduction of Sn99Cu1/Cu solder joints as a result of isothermal aging

    Study of height reduction of Sn99Cu1/Cu solder joints as a result of isothermal aging by Zhiwen Chen, Changqing Liu, Yiping Wu, Bing An, Longzao Zhou

    Published 2015
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  41. 41
    Process and performance modelling for individual ACA conductor particles

    Process and performance modelling for individual ACA conductor particles by Junlei Tao, David Whalley, Changqing Liu, J.Y. He

    Published 2014
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  42. 42
    Low frequency induction heating for the sealing of plastic microfluidic systems

    Low frequency induction heating for the sealing of plastic microfluidic systems by Benedikt J. Knauf, Patrick Webb, Changqing Liu, Paul Conway

    Published 2010
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  43. 43
    Micro-mechanical and fracture characteristics of Cu6Sn5 and Cu3Sn intermetallic compounds under micro-cantilever bending

    Micro-mechanical and fracture characteristics of Cu6Sn5 and Cu3Sn intermetallic compounds under micro-cantilever bending by Li Liu, Zhiwen Chen, Changqing Liu, Yiping Wu, Bing An

    Published 2016
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  44. 44
    Evolution of the hardness and Young’s moduli of interlayers in Sn99Cu1/Cu solder joints subjected to isothermal ageing

    Evolution of the hardness and Young’s moduli of interlayers in Sn99Cu1/Cu solder joints subjected to isothermal ageing by Zhiwen Chen, Changqing Liu, Bing An, Yiping Wu, Li Liu

    Published 2017
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  45. 45
    Nano Ag sintering on Cu substrate assisted by self-assembled monolayers for high-temperature electronics packaging

    Nano Ag sintering on Cu substrate assisted by self-assembled monolayers for high-temperature electronics packaging by Canyu Liu, Allan Liu, Yutai Su, Zhaoxia Zhou, Changqing Liu

    Published 2021
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  46. 46
    Preferential growth of intermetallics under temperature gradient at Cu-Sn interface during transient liquid phase bonding: insights from phase field simulation

    Preferential growth of intermetallics under temperature gradient at Cu-Sn interface during transient liquid phase bonding: insights from phase field simulation by Shuibao Liang, Anil Kunwar, Changqing Liu, Han Jiang, Zhaoxia Zhou

    Published 2022
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  47. 47
    Effect of direct current and pulse plating parameters on tin whisker growth from tin electrodeposits on copper and brass substrates

    Effect of direct current and pulse plating parameters on tin whisker growth from tin electrodeposits on copper and brass substrates by Mark Ashworth, Geoffrey Wilcox, Rebecca Higginson, Richard Heath, Changqing Liu

    Published 2013
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  48. 48
    An investigation into zinc diffusion and tin whisker growth for electroplated tin deposits on brass

    An investigation into zinc diffusion and tin whisker growth for electroplated tin deposits on brass by Mark Ashworth, Geoffrey Wilcox, Rebecca Higginson, Richard Heath, Changqing Liu

    Published 2014
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  49. 49
    Effects of fullerenes reinforcement on the performance of 96.5Sn–3Ag–0.5Cu lead-free solder

    Effects of fullerenes reinforcement on the performance of 96.5Sn–3Ag–0.5Cu lead-free solder by Guang Chen, Fengshun Wu, Changqing Liu, Weisheng Xia, Hui Liu

    Published 2015
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  50. 50
    Novel processes to enable deposition of metal coated polymer micro-spheres for flip-chip interconnections

    Novel processes to enable deposition of metal coated polymer micro-spheres for flip-chip interconnections by Junlei Tao, David Whalley, Changqing Liu, Fengshun Wu, H. Kristiansen

    Published 2015
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