Search Results - Jianfeng Li

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  1. 1
    Electroless Ni-W-P alloys as barrier coatings for liquid solder interconnects

    Electroless Ni-W-P alloys as barrier coatings for liquid solder interconnects by Keming Chen, Changqing Liu, David Whalley, David Hutt, Jianfeng Li, Samjid H. Mannan

    Published 2006
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  2. 2
    A comparative study of the interfacial reaction between electroless Ni-P coatings and molten tin

    A comparative study of the interfacial reaction between electroless Ni-P coatings and molten tin by Keming Chen, Changqing Liu, David Whalley, David Hutt, Jianfeng Li, Samjid H. Mannan

    Published 2008
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  3. 3
    Failure mechanisms of dummy IGBT assembles constructed using liquid in-Sn/Nb system

    Failure mechanisms of dummy IGBT assembles constructed using liquid in-Sn/Nb system by Jianfeng Li, Farhad Sarvar, David Whalley, David Hutt, Mike P. Clode, Samjid H. Mannan

    Published 2007
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  4. 4
    Interfacial reaction between molten Sn-Bi based solders and electroless Ni-P coatings for liquid solder interconnects

    Interfacial reaction between molten Sn-Bi based solders and electroless Ni-P coatings for liquid solder interconnects by Jianfeng Li, Samjid H. Mannan, Mike P. Clode, Keming Chen, David C. Whalley, David A. Hutt, Paul Conway

    Published 2008
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  5. 5
    Interactions between liquid Sn-Bi based solders and contact metals for high temperature applications

    Interactions between liquid Sn-Bi based solders and contact metals for high temperature applications by Jianfeng Li, Samjid H. Mannan, Mike P. Clode, H.M. Lobato, Changqing Liu, David Whalley, F.T. Lawrence, G. Jackson, H. Steen

    Published 2005
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