Search Results - Johan Liu

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    Computational modelling of the anisotropic conductive adhesive assembly process

    Computational modelling of the anisotropic conductive adhesive assembly process by David Whalley, Greg Glinsky, Chris Bailey, Johan Liu

    Published 2001
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  2. 2
    The effect of temperature ramp rate on flip-chip joint quality and reliability using anisotropically conductive adhesive on FR-4 substrate

    The effect of temperature ramp rate on flip-chip joint quality and reliability using anisotropically conductive adhesive on FR-4 substrate by Katrin Gustafsson, Samjid H. Mannan, Zonghe Lai, Johan Liu, David Whalley, David Williams

    Published 1997
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