Search Results - Lee, Y. C.

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  1. 1
    Manufacturing challenges in electronic packaging / [edited by]Y.C. Lee and W.T. Chen.

    Manufacturing challenges in electronic packaging / [edited by]Y.C. Lee and W.T. Chen.

    Published 1998
    Other Authors: “…Lee, Y. C.…”
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  2. 2
    Manufacturing aspects in electronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, California, November 8-13, 1992 / sponsored by the Electrical and Electronic Packaging Division and the Production Engineering Division, ASME ; edited by Y.C. Lee, T.J. Bennett..

    Manufacturing aspects in electronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, California, November 8-13, 1992 / s...

    Published 1992
    Other Authors: “…Lee, Y. C.…”
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  3. 3
    MEMS packaging editors, Y C Lee, Yu-Ting Cheng, Ramesh Ramadoss.

    MEMS packaging editors, Y C Lee, Yu-Ting Cheng, Ramesh Ramadoss.

    Published 2018
    Other Authors: “…Lee, Y.C…”
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