Search Results - 胡轶 李炎 刘玉岭 何彦刚

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    The optimization of FA/O barrier slurry with respect to removal rate selectivity on patterned Cu wafers

    The optimization of FA/O barrier slurry with respect to removal rate selectivity on patterned Cu wafers by 胡轶 李炎 刘玉岭 何彦刚

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    Planarization effect evaluation of acid and alkaline slurries in the copper interconnect process

    Planarization effect evaluation of acid and alkaline slurries in the copper interconnect process by 胡轶 李炎 刘玉岭 何彦刚

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