Search Results - 蒋勐婷 刘玉岭 袁浩博 陈国栋 刘伟娟

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  1. 1
    Effect of novel alkaline copper slurry on 300 mm copper global planarization

    Effect of novel alkaline copper slurry on 300 mm copper global planarization by 刘伟娟 刘玉岭 王辰伟 陈国栋 蒋勐婷 袁浩博 程鹏飞

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  2. 2
    Effect of H2O2 and nonionic surfactant in alkaline copper slurry

    Effect of H2O2 and nonionic surfactant in alkaline copper slurry by 袁浩博 刘玉岭 蒋勐婷 陈国栋 刘伟娟 王胜利

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  3. 3
    Effect of chelating agent concentration in alkaline Cu CMP process under the condition of different applied pressures

    Effect of chelating agent concentration in alkaline Cu CMP process under the condition of different applied pressures by 袁浩博 刘玉岭 蒋勐婷 刘伟娟 陈国栋

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  4. 4
    Evaluation of planarization performance for a novel alkaline copper slurry under a low abrasive concentration

    Evaluation of planarization performance for a novel alkaline copper slurry under a low abrasive concentration by 蒋勐婷 刘玉岭 袁浩博 陈国栋 刘伟娟

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  5. 5
    Stability for a novel low-pH alkaline slurry during the copper chemical mechanical planarization

    Stability for a novel low-pH alkaline slurry during the copper chemical mechanical planarization by 陈国栋 刘玉岭 王辰伟 刘伟娟 蒋勐婷 袁浩博

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