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    Evaluation of integrity and barrier performance of atomic layer deposited WN{sub x}C{sub y} films on plasma enhanced chemical vapor deposited SiO{sub 2} for Cu metallization

    Evaluation of integrity and barrier performance of atomic layer deposited WN{sub x}C{sub y} films on plasma enhanced chemical vapor deposited SiO{sub 2} for Cu metallization by Kim, Ki-Su, Lee, Moon-Sang, Yim, Sung-Soo, Kim, Hyun-Mi, Kim, Ki-Bum, Park, Hyung-Sang, Koh, Wonyong, Li, Wei-Min, Stokhof, Maarten, Sprey, Hessel, ASM Genitech Korea Ltd., Daejeon 306-230, ASM Microchemistry Ltd., Vaeinoe Auerin katu 12 A, 00560 Helsinki, ASM Belgium N.V., Kapeldreef 75, B-3001, Leuven

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