Intermetallic Compound Formation Mechanisms for Cu-Sn Solid–Liquid Interdiffusion Bonding by Liu, H., Wang, K., Aasmundtveit, K.E., Hoivik, N.

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Structure of thin films of poly(3,4-ethylenedioxythiophene) by Aasmundtveit, K.E., Samuelsen, E.J., Pettersson, L.A.A., Inganäs, O., Johansson, T., Feidenhans'l, R.

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Structural Anisotropy of Poly(alkylthiophene) Films by Aasmundtveit, K. E, Samuelsen, E. J, Guldstein, M, Steinsland, C, Flornes, O, Fagermo, C, Seeberg, T. M, Pettersson, L. A. A, Inganäs, O, Feidenhans'l, R, Ferrer, S

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Failure analysis of fabrication process in hermetic wafer-level packaging for microbolometer focal plane arrays by Xia, H., Roy, A., Nguyen, H.-V., Ramic, Z., Aasmundtveit, K.E., Ohlckers, P.

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Structural Ordering in Phenyl-Substituted Polythiophenes by Aasmundtveit, K. E, Samuelsen, E. J, Mammo, W, Svensson, M, Andersson, M. R, Pettersson, L. A. A, Inganäs, O

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Structural aspects of electrochemical doping and dedoping of poly(3,4-ethylenedioxythiophene) by Aasmundtveit, K.E, Samuelsen, E.J, Inganäs, O, Pettersson, L.A.A, Johansson, T, Ferrer, S

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Review—Recent Developments in Low Temperature Wafer Level Metal Bonding for Heterogenous Integration by Wernicke, T., Rebhan, B., Vuorinen, V., Paulasto-Kröckel, M., Dubey, V., Diex, K., Wünsch, D., Baum, M., Wiemer, M., Tanaka, S., Froemel, J., Aasmundtveit, K. E., Nguyen, H.-V., Dragoi, V.

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High Temperature Interconnect and Die Attach Technology: Au-Sn SLID Bonding by Tollefsen, T. A., Larsson, A., Lovvik, O. M., Aasmundtveit, K. E.

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Wafer-Level Cu/Sn to Cu/Sn SLID-Bonded Interconnects With Increased Strength by He Liu, Salomonsen, G., Kaiying Wang, Aasmundtveit, K. E., Hoivik, N.

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The structure of polypyridine by SAMUELSEN, E. J, MONKMAN, A. P, PETTERSSON, L. A. A, HORSBURGH, L. E, AASMUNDTVEIT, K. E, FERRER, S

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Miniaturization of package for an implantable heart monitoring device by Nguyen, Anh-Tuan T., Tjulkins, Fjodors, Aasmundtveit, K. E., Hoivik, Nils, Hoff, Lars, Imenes, Kristin

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EXAFS studies of iodine-doped poly(octylthiophene) by Aasmundtveit, K.E., Samuelsen, E.J., Steinsland, C., Meneghini, C., Filipponi, A.

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Structural studies of polyalkylthiophenes with alternating sidechain positioning by Aasmundtveit, K.E, Samuelsen, E.J, Hoffmann, K, Bakken, E, Carlsen, P.H.J

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Oxygen-induced ESR line broadening in conducting polymers by Aasmundtveit, K., Genoud, F., Houzé, E., Nechtschein, M.

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Intermetallic Cu3Sn as oxidation barrier for fluxless Cu-Sn bonding by Liu, H, Wang, K, Aasmundtveit, K, Hoivik, N

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Role of sidechain sequence in stereoregular polyalkylterthiophene by Konestabo, Ove R, Aasmundtveit, K.E., Samuelsen, E.J., Bakken, E., Carlsen, P.H.J.

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Lattice simulations of thermochromic distortions in poly(alkylthiophene)s by Xie, Hongwei, Corish, J., Ali, S.G., Morton-Blake, D.A., Aasmundtveit, K.

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Orientation effect in thin layers of poly(octylthiophene) on glass studied by synchrotron X-ray diffraction by Aasmundtveit, K.E., Samuelsen, E.J., Mrdalen, J., Bakken, E., Carlsen, P.H.J., Lienert, U.

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An atomistic simulation of thermochromic distortions in poly(3-butylthiophene) by Xie, Hongwei, Corish, J., Morton-Blake, D. A., Aasmundtveit, K.

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Surface evolution and bonding properties of electroplated Au/Sn/Au by Wang, K., Aasmundtveit, K., Jakobsen, H.

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