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Residual Stress Properties of Nickel and Copper Deposits Used for C4 Interconnects
by
Arvin, Charles L.
,
Scott, George
,
Goldsmith, Charles
,
Parks, Christopher
,
Wang, Chen
,
Zhang, Yun
,
Abys, Joe
,
Takahashi, Ken
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Considerations for the long term reliability of PCBs in harsh environmental conditions
by
Kenny, Jim
,
Wengenroth, Karl
,
Abys, Joe
,
Mui, Marco
,
Wynschenk, Jo
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Conference Proceeding
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Assembly
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Copper
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Corrosion
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Electrochemistry
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Nanoscience & Nanotechnology
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Physical Sciences
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Science & Technology
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Silver
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Surface Finishing
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Testing
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Ieee Electronic Library (Iel) Conference Proceedings
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Institute Of Physics:jisc Collections:iop Publishing Read And Publish 2024-2025 (Reading List)
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Ieee Xplore All Conference Series
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Institute Of Physics Iopscience Extra
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