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Search Results - Adebayo Oluyinka Ogunjimi
Search Results - Adebayo Oluyinka Ogunjimi
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Finite element modelling of the thermal effects of the manufacturing process on the quality of electronics interconnection
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Adebayo Oluyinka Ogunjimi
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Thermal stress analysis of conductive adhesive joints
by
Adebayo Oluyinka Ogunjimi
,
David Whalley
,
David Williams
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Assembly of planar array components using anisotropic conducting adhesives: a benchmark study. Part II - theory
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Samjid H. Mannan
,
David Whalley
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Adebayo Oluyinka Ogunjimi
,
David Williams
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Assembly of planar array components using anisotropic conducting adhesives: a benchmark study. Part I - experiment
by
Adebayo Oluyinka Ogunjimi
,
Samjid H. Mannan
,
David Whalley
,
David Williams
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A comparison of modelling methods for electronic interconnect structures
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Adebayo Oluyinka Ogunjimi
,
David Whalley
,
David Williams
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Modelling of the initial stages of the anisotropic adhesive joint assembly process
by
Samjid H. Mannan
,
David Whalley
,
Adebayo Oluyinka Ogunjimi
,
David Williams
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A process model of the infra-red reflow soldering of printed circuit board assemblies
by
David Whalley
,
Adebayo Oluyinka Ogunjimi
,
Paul Conway
,
David Williams
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Mechanical Engineering Not Elsewhere Classified
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Anisotropic Conducting Adhesive
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Anisotropic Conductive Adhesive
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Computational Fluid Dynamics
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Flip-Chip
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Flip-Chip Assembly
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Micro-Electronics Assembly
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Loughborough University Institutional Repository Open Access
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