Search Results - Alimonda, A.S.

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  1. 1
    A new flip-chip technology for high-density packaging

    A new flip-chip technology for high-density packaging by Smith, D.L., Alimonda, A.S.

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    Striped-substrate double-heterostructure lasers

    Striped-substrate double-heterostructure lasers by Burnham, R., Scifres, D., Tramontana, J., Alimonda, A.

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  3. 3
    Flip-chip bonding on 6-/spl mu/m pitch using thin-film microspring technology

    Flip-chip bonding on 6-/spl mu/m pitch using thin-film microspring technology by Smith, D.L., Fork, D.K., Thornton, R.L., Alimonda, A.S., Chua, C.L., Dunnrowicz, C., Ho, J.

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