Search Results - Amalu, E. H.

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  1. 1
    Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges

    Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges by Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S., Alam, M.O., Amalu, E.H.

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  2. 2
    Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device

    Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device by Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S., Alam, M.O., Amalu, E.H., Ekpu, M.

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  3. 3
    Optimization of thermo-mechanical reliability of solder joints in crystalline silicon solar cell assembly

    Optimization of thermo-mechanical reliability of solder joints in crystalline silicon solar cell assembly by Zarmai, M.T., Ekere, N.N., Oduoza, C.F., Amalu, E.H.

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  4. 4
    Evaluation of rheological properties of lead-free solder pastes and their relationship with transfer efficiency during stencil printing process

    Evaluation of rheological properties of lead-free solder pastes and their relationship with transfer efficiency during stencil printing process by Amalu, E.H., Ekere, N.N., Mallik, S.

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  5. 5
    A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits

    A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits by Amalu, E.H., Lau, W.K., Ekere, N.N., Bhatti, R.S., Mallik, S., Otiaba, K.C., Takyi, G.

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  6. 6
    High temperature electronics: R&D challenges and trends in materials, packaging and interconnection technology

    High temperature electronics: R&D challenges and trends in materials, packaging and interconnection technology by Amalu, E.H., Ekere, N.N., Bhatti, R.S.

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  7. 7
    Effects of inter-metallic compound on high temperature reliability of flip chip interconnects for fine pitch applications

    Effects of inter-metallic compound on high temperature reliability of flip chip interconnects for fine pitch applications by Amalu, E. H., Ekere, N. N., Aminu, G.

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  8. 8
    Thermal effects of die-attach voids location and style on performance of chip level package

    Thermal effects of die-attach voids location and style on performance of chip level package by Otiaba, K. C., Bhatti, R. S., Ekere, N. N., Mallik, S., Amalu, E. H., Ekpu, M.

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  9. 9
    Emerging nanotechnology-based thermal interface materials for automotive electronic control unit application

    Emerging nanotechnology-based thermal interface materials for automotive electronic control unit application by Otiaba, K. C., Ekere, N. N., Bhatti, R. S., Mallik, S., Amalu, E. H.

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  10. 10
    Critical solder joint in insulated gate bipolar transistors (IGBT) power module for improved mechanical reliability

    Critical solder joint in insulated gate bipolar transistors (IGBT) power module for improved mechanical reliability by Nebo, Sunday E., Amalu, Emeka H., Hughes, David J.

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  11. 11
    Effects of Reflow Profile and Miniaturisation on the Integrity of Solder Joints in Surface Mount Chip Resistors

    Effects of Reflow Profile and Miniaturisation on the Integrity of Solder Joints in Surface Mount Chip Resistors by Njoku, Jude E., Amalu, Emeka H., Ekere, Ndy, Mallik, Sabuj, Ekpu, Mathias, Ogbodo, Eugene A.

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  12. 12
    Effect of component standoff height on thermo-mechanical reliability of ball grid array (BGA) solder joints operating in high-temperature ambient

    Effect of component standoff height on thermo-mechanical reliability of ball grid array (BGA) solder joints operating in high-temperature ambient by Njoku, Jude E., Mallik, Sabuj, Bhatti, Raj, Amalu, Emeka H., Ekere, N. N.

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