Use of anionic surfactants for selective polishing of silicon dioxide over silicon nitride films using colloidal silica-based slurries by Penta, Naresh K., Amanapu, H.P., Peethala, B.C., Babu, S.V.

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Role of hydrogen bonding on the adsorption of several amino acids on SiO2 and Si3N4 and selective polishing of these materials using ceria dispersions by Penta, Naresh K., Peethala, B.C., Amanapu, H.P., Melman, A., Babu, S.V.

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A 7nm FinFET technology featuring EUV patterning and dual strained high mobility channels by Xie, R., Montanini, P., Akarvardar, K., Tripathi, N., Haran, B., Johnson, S., Hook, T., Hamieh, B., Corliss, D., Wang, J., Miao, X., Sporre, J., Fronheiser, J., Loubet, N., Sung, M., Sieg, S., Mochizuki, S., Prindle, C., Seo, S., Greene, A., Shearer, J., Labonte, A., Fan, S., Liebmann, L., Chao, R., Arceo, A., Chung, K., Cheon, K., Adusumilli, P., Amanapu, H. P., Bi, Z., Cha, J., Chen, H.-C, Conti, R., Galatage, R., Gluschenkov, O., Kamineni, V., Kim, K., Lee, C., Lie, F., Liu, Z., Mehta, S., Miller, E., Niimi, H., Niu, C., Park, C., Park, D., Raymond, M., Sahu, B., Sankarapandian, M., Siddiqui, S., Southwick, R., Sun, L., Surisetty, C., Tsai, S., Whang, S., Xu, P., Xu, Y., Yeh, C., Zeitzoff, P., Zhang, J., Li, J., Demarest, J., Arnold, J., Canaperi, D., Dunn, D., Felix, N., Gupta, D., Jagannathan, H., Kanakasabapathy, S., Kleemeier, W., Labelle, C., Mottura, M., Oldiges, P., Skordas, S., Standaert, T., Yamashita, T., Colburn, M., Na, M., Paruchuri, V., Lian, S., Divakaruni, R., Gow, T., Lee, S., Knorr, A., Bu, H., Khare, M.

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