Search Results - Ano, Kazuaki

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    Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability

    Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability by Zeng, Kejun, Stierman, Roger, Chiu, Tz-Cheng, Edwards, Darvin, Ano, Kazuaki, Tu, K. N.

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  2. 2
    Effect of thermal aging on board level drop reliability for Pb-free BGA packages

    Effect of thermal aging on board level drop reliability for Pb-free BGA packages by CHIU, Tz-Cheng, KEJUN ZENG, STIERMAN, Roger, EDWARDS, Darvin, ANO, Kazuaki

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