Search Results - Arkalgud, S

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  1. 1
    Incomplete Left Atrial Appendage Ligation Diagnosed Intraoperatively Using Transesophageal Echocardiography Following Mitral Valve Repair

    Incomplete Left Atrial Appendage Ligation Diagnosed Intraoperatively Using Transesophageal Echocardiography Following Mitral Valve Repair by Gharde, Parag, MD, DM, Malik, Madhur, MD, Gupta, Anubhav, MS, MCh, Chauhan, Sandeep, MD, PDCC, Kumar, Arkalgud S., MS, MCh, Kiran, Usha, MD

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  2. 2
    Scanning Acoustic Microscope of 3D-Interconnect

    Scanning Acoustic Microscope of 3D-Interconnect by Kong, Lay Wai, Diebold, A C, Rudack, A, Arkalgud, S

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  3. 3
    3D-TSV overview

    3D-TSV overview by Arkalgud, S

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  4. 4
    Yield considerations in the choice of 3D technology

    Yield considerations in the choice of 3D technology by Smith, G., Smith, L., Hosali, S., Arkalgud, S.

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  5. 5
    Multi-modality blood conservation strategy in open-heart surgery: an audit

    Multi-modality blood conservation strategy in open-heart surgery: an audit by Reddy, Srikrishna Modugula, Talwar, Sachin, Velayoudam, Devgourou, Gharde, Parag, Mallick, Vishwas, Jha, Raju Kumar, Kumar, Lokender, Arkalgud, Sampath Kumar

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  6. 6
    A systematic study of I/O device designs for TSV-based 3D chip stacking

    A systematic study of I/O device designs for TSV-based 3D chip stacking by Kang, C Y, Park, H, Singh, P, Smith, L, Arkalgud, S, Kirsch, P D, Jammy, R

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  7. 7
    On the technology and ecosystem of 3D / TSV manufacturing

    On the technology and ecosystem of 3D / TSV manufacturing by Hummler, K., Smith, L., Caramto, R., Edgeworth, R., Olson, S., Pascual, D., Qureshi, J., Rudack, A., Quon, R., Arkalgud, S.

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  8. 8
    Emerging CMOS and beyond CMOS technologies for an ultra-low power 3D world

    Emerging CMOS and beyond CMOS technologies for an ultra-low power 3D world by Kang, CY, Ang, KW, Hill, R., Loh, WY, Oh, J., Lee, R., Gilmer, D., Bersuker, G., Hobbs, C., Kirsch, P., Hummler, K., Arkalgud, S., Jammy, R.

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  9. 9
    Via mid through silicon vias - the manufacturability outlook

    Via mid through silicon vias - the manufacturability outlook by Arkalgud, S

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  10. 10
    Via mid through silicon vias - the manufacturability outlook

    Via mid through silicon vias - the manufacturability outlook by Arkalgud, S

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  11. 11
    Planar interconnects to 3D interconnects

    Planar interconnects to 3D interconnects by Arkalgud, S. R.

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  12. 12
    Magnetically-enhanced capacitively-coupled plasma etching for 300 mm wafer-scale fabrication of Cu through-silicon-vias for 3D logic integration

    Magnetically-enhanced capacitively-coupled plasma etching for 300 mm wafer-scale fabrication of Cu through-silicon-vias for 3D logic integration by Teh, W.H., Caramto, R., Arkalgud, S., Saito, T., Maruyama, K., Maekawa, K.

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  13. 13
    Incomplete left atrial appendage ligation diagnosed intraoperatively using transesophageal echocardiography following mitral valve repair

    Incomplete left atrial appendage ligation diagnosed intraoperatively using transesophageal echocardiography following mitral valve repair by Gharde, Parag, Malik, Madhur, Gupta, Anubhav, Chauhan, Sandeep, Kumar, Arkalgud S, Kiran, Usha

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  14. 14
    A route towards production-worthy 5 µm × 25 µm and 1 µm × 20 µm non-Bosch through-silicon-via (TSV) etch, TSV metrology, and TSV integration

    A route towards production-worthy 5 µm × 25 µm and 1 µm × 20 µm non-Bosch through-silicon-via (TSV) etch, TSV metrology, and TSV integration by Teh, W.H., Caramto, R., Qureshi, J., Arkalgud, S., O'Brien, M., Gilday, T., Maekawa, K., Saito, T., Maruyama, K., Chidambaram, T., Wang, W., Marx, D., Grant, D., Dudley, R.

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  15. 15
    Do not attempt resuscitation

    Do not attempt resuscitation by Sampathkumar, Arkalgud

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  16. 16
    Access to Healthcare during COVID-19

    Access to Healthcare during COVID-19 by Núñez, Alicia, Sreeganga, S D, Ramaprasad, Arkalgud

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  17. 17
    Mitral valve replacement in infants

    Mitral valve replacement in infants by Sampathkumar, Arkalgud

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  18. 18
    Definition of Food Consumption, Loss, and Waste

    Definition of Food Consumption, Loss, and Waste by Ramaprasad, Arkalgud, Kashyap, Shwetmala

    Published in Sustainability
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  19. 19
    Geographical and temporal analysis of bio-medical waste management in India

    Geographical and temporal analysis of bio-medical waste management in India by Kashyap, Shwetmala, Ramaprasad, Arkalgud

    Published in GeoJournal
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  20. 20
    Enlarging the surgeon's mind in aortic stenosis

    Enlarging the surgeon's mind in aortic stenosis by Kumar, Arkalgud Sampath

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