Search Results - Arkalgud, Sitaram R

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  1. 1
    300-mm Production-Worthy Magnetically Enhanced Non-Bosch Through-Si-Via Etch for 3-D Logic Integration

    300-mm Production-Worthy Magnetically Enhanced Non-Bosch Through-Si-Via Etch for 3-D Logic Integration by Teh, W H, Caramto, R, Chidambaram, Thenappan, Wei Wang, Arkalgud, Sitaram R, Saito, T, Maruyama, K, Maekawa, Kaoru

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  2. 2
    Leading edge 3D technology for high volume manufacturing

    Leading edge 3D technology for high volume manufacturing by Arkalgud, S.R.

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  3. 3
    A 16-Mb MRAM featuring bootstrapped write drivers

    A 16-Mb MRAM featuring bootstrapped write drivers by Gogl, D., Arndt, C., Barwin, J.C., Bette, A., DeBrosse, J., Gow, E., Hoenigschmid, H., Lammers, S., Lamorey, M., Yu Lu, Maffitt, T., Maloney, K., Obermaier, W., Sturm, A., Viehmann, H., Willmott, D., Wood, M., Gallagher, W.J., Mueller, G., Sitaram, A.R.

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  4. 4
    On the technology and ecosystem of 3D / TSV manufacturing

    On the technology and ecosystem of 3D / TSV manufacturing by Hummler, K., Smith, L., Caramto, R., Edgeworth, R., Olson, S., Pascual, D., Qureshi, J., Rudack, A., Quon, R., Arkalgud, S.

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