Polymer Optical Interconnects-A Scalable Large-Area Panel Processing Approach by Uhlig, S., Frohlich, L., Chen, M., Arndt-Staufenbiel, N., Lang, G., Schroder, H., Houbertz, R., Popall, M., Robertsson, M.

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New technology for electrical/optical systems on module and board level: the EOCB approach by Krabe, D., Ebling, F., Arndt-Staufenbiel, N., Lang, G., Scheel, W.

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Glass panel processing for electrical and optical packaging by Schroder, H., Brusberg, L., Arndt-Staufenbiel, N., Hofmann, J., Marx, S.

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Advanced thin glass based photonic PCB integration by Schroder, H., Brusberg, L., Arndt-Staufenbiel, N., Richlowski, K., Ranzinger, C., Lang, K.

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"glassPack" - photonic packaging using thin glass foils for electrical-optical circuit boards (EOCB) and sensor modules by Schroder, H., Arndt-Staufenbiel, N., Brusberg, L.

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Thin glass based electrical-optical circuit boards (EOCB) using ion-exchange technology for graded-index multimode waveguides by Schroder, H., Arndt-Staufenbiel, N., Beier, A., Ebling, F., Franke, M., Griese, E., Intemann, S., Kostelnik, J., Kuhler, T., Modinger, R., Roda, I., Schlosser, I.

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Thin glass based packaging technologies for optoelectronic modules by Brusberg, L., Schroder, H., Topper, M., Arndt-Staufenbiel, N., Roder, J., Lutz, M., Reichl, H.

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