Search Results - Azdasht, Ghassem

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  1. 1
    Micro ball bumping packaging for wafer level & 3-d solder sphere transfer and solder jetting

    Micro ball bumping packaging for wafer level & 3-d solder sphere transfer and solder jetting by Oppert, T., Teutsch, T., Azdasht, G., Zakel, E.

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  2. 2
    WLCSP and Flip Chip bumping technologies

    WLCSP and Flip Chip bumping technologies by Strandjord, Andrew, Teutsch, Thorsten, Scheffler, Axel, Oppert, Thomas, Azdasht, Ghassem, Zakel, Elke

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  3. 3
    Degradation of TAB outer lead contacts due to the Au-concentration in eutectic tin/lead solder

    Degradation of TAB outer lead contacts due to the Au-concentration in eutectic tin/lead solder by Zakel, E., Azdasht, G., Reichl, H.

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  4. 4
    Fluxless die bonding of high power laser bars using the AuSn-metallurgy

    Fluxless die bonding of high power laser bars using the AuSn-metallurgy by Weiss, S., Bader, V., Azdasht, G., Kasulke, P., Zakel, E., Reichl, H.

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  5. 5
    Degradation Of Tab Outer Lead Contacts Due To The Au Concentration In Eutectic Tin/lead Solder

    Degradation Of Tab Outer Lead Contacts Due To The Au Concentration In Eutectic Tin/lead Solder by Zakel, E., Azdasht, G., Reich, H.

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  6. 6
    Pulsed-laser Heating for Flip Chip Assembly

    Pulsed-laser Heating for Flip Chip Assembly by Teutsch, Thorsten, Zakel, Elke, Azdasht, Ghassem

    Published in Advanced packaging
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  7. 7
    Investigations of laser soldered TAB inner lead contacts

    Investigations of laser soldered TAB inner lead contacts by Zakel, E., Azdasht, G., Reichl, H.

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  8. 8
    Investigations of laser soldered TAB inner lead contacts

    Investigations of laser soldered TAB inner lead contacts by Zakel, E., Azdasht, G., Reichl, H.

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  9. 9
    Reliability investigations of different tape metallizations for TAB-outer lead bonding

    Reliability investigations of different tape metallizations for TAB-outer lead bonding by Zakel, E., Azdasht, G., Kruppa, P., Reichl, H.

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  10. 10
    A new approach to chip size package using meniscus soldering and FPC-bonding

    A new approach to chip size package using meniscus soldering and FPC-bonding by Kallmayer, C., Jung, E., Kasulke, P., Azadeh, R., Azdasht, G., Zakel, E., Reichl, H.

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  11. 11
    A new approach to chip size package using meniscus soldering and FPC-bonding

    A new approach to chip size package using meniscus soldering and FPC-bonding by Kallmayer, C., Jung, E., Kasulke, P., Azadeh, R., Azdasht, G., Zakel, E., Reichl, H.

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