Search Results - BEIHOFF, B

  • Showing 1 - 8 results of 8
Refine Results
  1. 1
    Packaging of integrated solid-state power assembly cells: a thermomechanics-based approach

    Packaging of integrated solid-state power assembly cells: a thermomechanics-based approach by Shaw, M.C., Beihoff, B.C.

    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  2. 2
    Laminated steel eddy-current loss versus frequency computed using finite elements

    Laminated steel eddy-current loss versus frequency computed using finite elements by Brauer, J.R., Cendes, Z.J., Beihoff, B.C., Phillips, K.P.

    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  3. 3
    Power cell concepts for the next generation of appliances

    Power cell concepts for the next generation of appliances by Beihoff, B.

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  4. 4
    Magnetoelastic effects in amorphous wires and amorphous ribbons with nonmagnetic thin-film coatings

    Magnetoelastic effects in amorphous wires and amorphous ribbons with nonmagnetic thin-film coatings by WUN-FOGLE, M, SAVAGE, H. T, KABACOFF, L. T, HATHAWAY, K. B, MERCHANT, J. M, BEIHOFF, B

    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  5. 5
    Investigation of parallel operation of IGBTs

    Investigation of parallel operation of IGBTs by Nelson, J.J., Venkataramanan, G., Beihoff, B.C.

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  6. 6
    A survey of torque transduction methodologies for industrial applications

    A survey of torque transduction methodologies for industrial applications by Beihoff, B.

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  7. 7
    The future of electronic packaging for solid state power technology: the transition of E-packaging to electromechanical engineering

    The future of electronic packaging for solid state power technology: the transition of E-packaging to electromechanical engineering by Kehl, D., Beihoff, B.

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  8. 8
    Laminated steel eddy current loss versus frequency computed using finite elements

    Laminated steel eddy current loss versus frequency computed using finite elements by Brauer, J.R., Cendes, Z.J., Beihoff, B.C., Phillips, K.P.

    Request full text
    Conference Proceeding
    Save to List
    Saved in:

Search Tools: