Electromigration-Induced Plastic Deformation in Cu Interconnects: Effects on Current Density Exponent, n, and Implications for EM Reliability Assessment by Budiman, A.S., Hau-Riege, C.S., Baek, W.C., Lor, C., Huang, A., Kim, H.S., Neubauer, G., Pak, J., Besser, P.R., Nix, W.D.

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Electromigration-Induced Plasticity: Texture Correlation and Implications for Reliability Assessment by Budiman, A.S., Besser, P.R., Hau-Riege, C.S., Marathe, A., Joo, Y.-C., Tamura, N., Patel, J.R., Nix, W.D.

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Effect of film thickness on the evolution of annealing texture in sputtered copper films by Park, N. -J., Field, D. P., Nowell, M. M., Besser, P. R.

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Microstructural characterization of inlaid copper interconnect lines by BESSER, Paul R, ZSCHECH, Ehrenfried, BAKER, Brett, BRAECKELMANN, Greg, ZHAO, Larry, SIMPSON, Cindy, CAPASSO, Cristiano, KAWASAKI, Hisao, WEITZMAN, Elizabeth, BLUM, Werner, WINTER, Delrose, ORTEGA, Richard, ROSE, Stewart, HERRICK, Matt, GALL, Martin, THRASHER, Stacye, TINER, Mike

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Electromigration-induced Plasticity and Texture in Cu Interconnects by Budiman, A S, Hau-Riege, C S, Besser, P R, Marathe, A, Joo, Y-C, Tamura, N, Patel, J R, Nix, W D

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Scalp, basal epidural and intravascular far-field recordings after median nerve stimulation: evidence for a separate N18a potential by Koehler, R. Besser, P. Stoeter, P. P. Urban, H. C. Hopf, J.

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Texture analysis of damascene-fabricated Cu lines by x-ray diffraction and electron backscatter diffraction and its impact on electromigration performance by Vanasupa, Linda, Joo, Young-Chang, Besser, Paul R., Pramanick, Shekhar

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Understanding stress gradients in microelectronic metallization by Murray, Conal E., Ryan, E. Todd, Besser, Paul R., Witt, Christian, Jordan-Sweet, Jean L., Toney, Michael F.

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Ge effects on silicidation by Besser, Paul R., King, Paul, Paton, Eric, Robie, Stephen

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Plasticity-Amplified Diffusivity: Dislocation Cores as Fast Diffusion Paths in CU Interconnects by Budiman, A.S., Hau-Riege, C.S., Besser, P.R., Marathe, A., Joo, Y.-C., Tamura, N., Patel, J.R., Nix, W.D.

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Microstructure characterization of metal interconnects and barrier layers: status and future by Zschech, E., Besser, P.R.

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Analysis of grain-boundary structure in Al–Cu interconnects by Field, David P., Sanchez, John E., Besser, Paul R., Dingley, David J.

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Modeling and Measurement of Stress and Strain Evolution in Cu Interconnects by Besser, Paul R., Zhai, Charlie Jun

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Modelling microstructure development in trench-interconnect structures by Sanchez, J., Besser, P.R.

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Effect of film thickness on the evolution of annealing texture in sputtered copper films : Microstructures and textures of films and coatings and refractory metals in electronic ap... by PARK, N.-J, FIELD, D. P, NOWELL, M. M, BESSER, P. R

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In situ scanning electron microscopy observation of the dynamic behavior of electromigration voidcs in passivated aluminum lines by BESSER, P. R, MADDEN, M. C, FLINN, . A

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Simulation and experiments of stress migration for Cu/low-k BEoL by Zhai, C.J., Yao, H.W., Marathe, A.P., Besser, P.R., Blish, R.C.

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Finite-element modeling and X-ray measurement of strain in passivated Al lines during thermal cycling by Besser, P.R., Bravman, J.C., Mack, A.S., Fraser, D.B.

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Finite-element modeling and X-ray measurement of strain in passivated Al lines during thermal cycling by BESSER, P. R, MACK, A. S, FRASER, D. B, BRAVMAN, J. C

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Identification of bacteria-derived HLA-bound peptides in melanoma by Kalaora, Shelly, Nagler, Adi, Nejman, Deborah, Alon, Michal, Barbolin, Chaya, Barnea, Eilon, Ketelaars, Steven L. C., Cheng, Kuoyuan, Vervier, Kevin, Shental, Noam, Bussi, Yuval, Rotkopf, Ron, Levy, Ronen, Benedek, Gil, Trabish, Sophie, Dadosh, Tali, Levin-Zaidman, Smadar, Geller, Leore T., Wang, Kun, Greenberg, Polina, Yagel, Gal, Peri, Aviyah, Fuks, Garold, Bhardwaj, Neerupma, Reuben, Alexandre, Hermida, Leandro, Johnson, Sarah B., Galloway-Peña, Jessica R., Shropshire, William C., Bernatchez, Chantale, Haymaker, Cara, Arora, Reetakshi, Roitman, Lior, Eilam, Raya, Weinberger, Adina, Lotan-Pompan, Maya, Lotem, Michal, Admon, Arie, Levin, Yishai, Lawley, Trevor D., Adams, David J., Levesque, Mitchell P., Besser, Michal J., Schachter, Jacob, Golani, Ofra, Segal, Eran, Geva-Zatorsky, Naama, Ruppin, Eytan, Kvistborg, Pia, Peterson, Scott N., Wargo, Jennifer A., Straussman, Ravid, Samuels, Yardena

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