Focused ion beam imaging of grain growth in copper thin films by BUPTA, J, HARPER, J. M. E, MAUER, J. L, BLAUNER, P. G, SMITH, D. A

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Electromigration failure due to interfacial diffusion in fine Al alloy lines by HU, C.-K, SMALL, M. B, RODBELL, K. P, STANIS, C, BLAUNER, P, HO, P. S

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X-ray mask repair by Blauner, P. G., Mauer, J.

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Fabrication of high performance 512Kb SRAMs in 0.25 μm CMOS technology using x-ray lithography by Viswanathan, R., Seeger, D., Bright, A., Bucelot, T., Pomerene, A., Petrillo, K., Blauner, P., Agnello, P., Warlaumont, J., Conway, J., Patel, D.

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Secondary-ion emission from clean and oxidized aluminum as a function of incident ion mass and energy by BLAUNER, P. G, WELLER, R. A

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Secondary-ion emission from vanadium as a function of incident ion mass and energy in the range 25-275 keV by BLAUNER, P. G, WELLER, R. A

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Electromigration Failure Due to Interfacial Diffusion on Fine Aluminum Lines by Hu, C-K, Small, M B, Rodbell, K P, Stanis, C, Blauner, P, Ho, P S

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Racial Equations

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The role of focused ion beams in physical failure analysis (ICs) by Matusiewicz, G.R., Kirch, S.J., Seeley, V.J.

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Still the Big News: Racial Oppression in America by Hier, Sean P.

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