Search Results - BOPING WU

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  1. 21
    Fast Computation of Layered Medium Greenas Functions of Multilayers and Lossy Media Using Fast All-Modes Method and Numerical Modified Steepest Descent Path Method

    Fast Computation of Layered Medium Greenas Functions of Multilayers and Lossy Media Using Fast All-Modes Method and Numerical Modified Steepest Descent Path Method by Wu, Boping, Tsang, Leung

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  2. 22
    Is 25 Gb/s On-Board Signaling Viable?

    Is 25 Gb/s On-Board Signaling Viable? by Kam, D.G., Ritter, M.B., Beukema, T.J., Bulzacchelli, J.F., Pepeljugoski, P.K., Kwark, Y.H., Lei Shan, Xiaoxiong Gu, Baks, C.W., John, R.A., Hougham, G., Schuster, C., Rimolo-Donadio, R., Boping Wu

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  3. 23
    FULL-WAVE MODELING OF MULTIPLE VIAS USING DIFFERENTIAL SIGNALING AND SHARED ANTIPAD IN MULTILAYERED HIGH SPEED VERTICAL INTERCONNECTS

    FULL-WAVE MODELING OF MULTIPLE VIAS USING DIFFERENTIAL SIGNALING AND SHARED ANTIPAD IN MULTILAYERED HIGH SPEED VERTICAL INTERCONNECTS by Wu, Boping, Tsang, Leung

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  4. 24
    METHODS AND DESIGNS FOR IMPROVING THE SIGNAL INTEGRITY OF VERTICAL INTERCONNECTS IN HIGH PERFORMANCE PACKAGING

    METHODS AND DESIGNS FOR IMPROVING THE SIGNAL INTEGRITY OF VERTICAL INTERCONNECTS IN HIGH PERFORMANCE PACKAGING by Wu, B, Lo, H.L

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  5. 25
    Signal Integrity Analysis of Package and Printed Circuit Board With Multiple Vias in Substrate of Layered Dielectrics

    Signal Integrity Analysis of Package and Printed Circuit Board With Multiple Vias in Substrate of Layered Dielectrics by Wu, Boping, Tsang, Leung

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  6. 26
    Electromagnetic modeling of massively coupled through silicon vias for 3D interconnects

    Electromagnetic modeling of massively coupled through silicon vias for 3D interconnects by Wu, Boping, Gu, Xiaoxiong, Tsang, Leung, Ritter, Mark B.

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  7. 27
    Micro-Cables out of High-Speed Communication Chip through Embedded Wires in the Package Substrate

    Micro-Cables out of High-Speed Communication Chip through Embedded Wires in the Package Substrate by Wu, Boping

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  8. 28
    Direct Cable Access to Chip Package through Dense Wires Embedded in the Substrate

    Direct Cable Access to Chip Package through Dense Wires Embedded in the Substrate by Wu, Boping

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  9. 29
    Barbed transmission lines for crosstalk suppression

    Barbed transmission lines for crosstalk suppression by Boping Wu, Tingting Mo

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  10. 30
    Substrate integrated common mode choke of EMI filter for high speed serial link

    Substrate integrated common mode choke of EMI filter for high speed serial link by Wu, Boping

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  11. 31
    Full-Wave Solver for Microstrip Trace and Through-Hole Via in Layered Media

    Full-Wave Solver for Microstrip Trace and Through-Hole Via in Layered Media by Chong-Jin Ong, Chong-Jin Ong, Boping Wu, Boping Wu, Leung Tsang, Leung Tsang, Xiaoxiong Gu, Xiaoxiong Gu

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  12. 32
    Methods and designs for improving the signal integrity for 3D electrical interconnects in high performance IC packaging

    Methods and designs for improving the signal integrity for 3D electrical interconnects in high performance IC packaging by Boping Wu, Haogang Wang

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  13. 33
    Efficient full-wave modeling of high density TSVs for 3D integration

    Efficient full-wave modeling of high density TSVs for 3D integration by Xiaoxiong Gu, Boping Wu, Ritter, Mark, Leung Tsang

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  14. 34
    Printed circuit board electrical design for wafer-level packaging

    Printed circuit board electrical design for wafer-level packaging by Boping Wu, Tingting Mo

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  15. 35
    Fast all modes (FAM) method combined with NMSP for evaluating spatial domain layered medium Green's functions of moderate thickness

    Fast all modes (FAM) method combined with NMSP for evaluating spatial domain layered medium Green's functions of moderate thickness by Wu, Boping, Tsang, Leung, Ong, Chong-Jin

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  16. 36
    Fast full wave analysis of PCB via arrays with model-to-hardware correlation

    Fast full wave analysis of PCB via arrays with model-to-hardware correlation by Xiaoxiong Gu, Boping Wu, Baks, C., Tsang, L.

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  17. 37
    Evaluation of time domain Green's functions for layered medium using FAM and NMSP methods

    Evaluation of time domain Green's functions for layered medium using FAM and NMSP methods by Boping Wu, Leung Tsang

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  18. 38
    Printed circuit board electrical design for wafer-level packaging

    Printed circuit board electrical design for wafer-level packaging by Wu, Boping, Mo, Tingting

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  19. 39
    The viability of 25 Gb/s on-board signalling

    The viability of 25 Gb/s on-board signalling by Ritter, M.B., Pepeljugoski, P., Xiaoxiong Gu, Young Kwark, Dong Kam, Rimolo-Donadio, R., Boping Wu, Baks, C., John, R., Lei Shan, Schuster, C.

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  20. 40
    Layer misregistration in PCB and its effects on signal propagation

    Layer misregistration in PCB and its effects on signal propagation by Lei Shan, Kwark, Young, Baks, Christian, Ritter, Mark

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