Tensor Nature of Permeability and Its Effects in Inductive Magnetic Devices by Liangliang Li, Dok Won Lee, Wang, S.X., Kyu-Pyung Hwang, Yongki Min, Ming Mao, Schneider, T., Bubber, R.

Get full text

AlCVD AlOx barrier layers for magnetic tunnel junction applications by BUBBER, R, MAO, M, SCHNEIDER, T, HEGDE, H, SIN, K, FUNADA, S, SHI, S

Get full text

Atomic layer deposition of AlOx for thin film head gap applications by PARANJPE, Ajit, GOPINATH, Sanjay, OMSTEAD, Tom, BUBBER, Randhir

Get full text

Soft magnetic granular material Co–Fe–Hf–O for micromagnetic device applications by Li, Liangliang, Crawford, Ankur M., Wang, Shan X., Marshall, Ann F., Mao, Ming, Schneider, Thomas, Bubber, Randhir

Get full text

Optimization of high B sat FeCo films for write pole applications by Mao, Ming, Schneider, Thomas, Bubber, Randhir, Kools, Jacques, Liu, Xubo, Altounian, Zaven, Lee, Chih-Ling, Devasahayam, Adrian, Rook, Katrina

Get full text

ALD for Data Storage Applications by Mao, Ming, Bubber, Randhir, Schneider, Thomas

Get full text

Small-Resistance and High-Quality-Factor Magnetic Integrated Inductors on PCB by Liangliang Li, Dok Won Lee, Kyu-Pyung Hwang, Yongki Min, Hizume, T., Tanaka, M., Ming Mao, Schneider, T., Bubber, R., Wang, S.X.

Get full text

Package Compatibility And Substrate Dependence of Granular Soft Magnetic Material CoFeHfO Developed By Reactive Sputtering by Li, L., Wang, S.X., /Stanford U., Materials Sci. Dept, Hwang, K.-P., Min, Y., /Intel, Chandler, Mao, M., Schneider, T., Bubber, R., /Veeco Instruments, Fremont

Get full text

Process monitoring of spin-valve GMR deposition by Kools, J.C.S., Paranjpe, L., Schwartz, P., Bubber, R., Bergner, B., Kula, W., Rijks, T.G.S.M.

Get full text

ALCVD AlO/sub x/ barrier layers for magnetic tunnel junction applications by Bubber, R., Mao, M., Schneider, T., Hegde, H., Sin, K., Funada, S., Shi, S.

Get full text

ALCVD AlO(x) barrier layers for magnetic tunnel junction applications by Bubber, R, Mao, M, Schneider, T, Hegde, H, Sin, K, Funada, S, Shi, S

Get full text

CVD TaN barrier for copper metallization and DRAM bottom electrode by Paranjpe, A., Bubber, R., Velo, L., Shang, G., Gopinath, S., Dalton, J., Moslehi, M.

Request full text

High Frequency Responses of Granular Magnetic Material CoFeHfO and Amorphous Material CoZrTa by Li, L., Lee, D., Wang, S.X., Mao, M., Schneider, T., Bubber, R., Hwang, K., Min, Y.

Request full text

ALCVD AlO/sub x/ barrier layers for magnetic tunnel junction applications by Bubber, R., Mao, M., Schneider, T., Hegde, H., Sin, K., Funada, S., Shi, S.

Request full text

Application of Phenomenological Description of Spin Valve Transport Properties to Desposition Process Control by Kools, J.C.S., Paranjpe, A.P., Schwartz, P.V., Bubber, R., Bergner, B., Kula, W., Rijks, Th.G.S.M.

Request full text