Search Results - Bachok, Zuraihana

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  1. 1
    Hyper-Elastic Characterization of Polydimethylsiloxane by Optimization Algorithms and Finite Element Methods

    Hyper-Elastic Characterization of Polydimethylsiloxane by Optimization Algorithms and Finite Element Methods by Zulfiqar, Sana, Saad, Abdullah Aziz, Huqqani, Ilyas Ahmad, Ahmad, Zulkifli, Yusof, Feizal, Bachok, Zuraihana

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  2. 2
    Investigation of hygrothermally induced failures in multilayer ceramic capacitors during thermal reflow process

    Investigation of hygrothermally induced failures in multilayer ceramic capacitors during thermal reflow process by Apalowo, Rilwan Kayode, Abas, Aizat, Bachok, Zuraihana, Sharif, Mohamad Fikri Mohd, Ani, Fakhrozi Che, Ramli, Mohamad Riduwan, Mukhtar, Muhamed Abdul Fatah bin Muhamed

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  3. 3
    Investigating the impact of different solder alloy materials during laser soldering process

    Investigating the impact of different solder alloy materials during laser soldering process by Bachok, Zuraihana, Abas, Aizat, Tang, Hooi Feng, Nazarudin, Muhammad Zaim Hanif, Mohd Sharif, Mohamad Fikri, Che Ani, Fakhrozi

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  4. 4
    Deformation and crack growth in multilayered ceramic capacitor during thermal reflow process: numerical and experimental investigation

    Deformation and crack growth in multilayered ceramic capacitor during thermal reflow process: numerical and experimental investigation by Apalowo, Rilwan Kayode, Abas, Mohamad Aizat, Bachok, Zuraihana, Sharif, Mohamad Fikri Mohd, Che Ani, Fakhrozi, Ramli, Mohamad Riduwan, Mukhtar, Muhamed Abdul Fatah bin Muhamed

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  5. 5
    SAC–xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly

    SAC–xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly by Che Ani, Fakhrozi, Jalar, Azman, Saad, Abdullah Aziz, Khor, Chu Yee, Ismail, Roslina, Bachok, Zuraihana, Abas, Mohamad Aizat, Othman, Norinsan Kamil

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  6. 6
    Investigation of moisture-induced crack propagation in the soft-termination multi-layer ceramic capacitor during thermal reflow process

    Investigation of moisture-induced crack propagation in the soft-termination multi-layer ceramic capacitor during thermal reflow process by Bachok, Zuraihana, Abas, Aizat, Raja Gobal, Hehgeraj A/L, Yusoff, Norwahida, Ramli, Mohamad Riduwan, Mohd Sharif, Mohamad Fikri, Che Ani, Fakhrozi, Muhamed Mukhtar, Muhamed Abdul Fatah

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  7. 7
    Characterization of SAC – x NiO nano-reinforced lead-free solder joint in an ultra-fine package assembly

    Characterization of SAC – x NiO nano-reinforced lead-free solder joint in an ultra-fine package assembly by Che Ani, Fakhrozi, Jalar, Azman, Saad, Abdullah Aziz, Khor, Chu Yee, Abas, Mohamad Aizat, Bachok, Zuraihana, Othman, Norinsan Kamil

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  8. 8
    SAC–xTiO 2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly

    SAC–xTiO 2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly by Che Ani, Fakhrozi, Jalar, Azman, Saad, Abdullah Aziz, Khor, Chu Yee, Ismail, Roslina, Bachok, Zuraihana, Abas, Mohamad Aizat, Othman, Norinsan Kamil

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