Search Results - Baggerman, A.F.J.

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  1. 1
    Cracking Behaviour during Au-Au TAB Inner Lead Bonding

    Cracking Behaviour during Au-Au TAB Inner Lead Bonding by Baggerman, A.F.J, Kessels, F.J.H

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  2. 2
    Cracking Behaviour during AuAu TAB Inner Lead Bonding

    Cracking Behaviour during AuAu TAB Inner Lead Bonding by Baggerman, A.F.J., Kessels, F.J.H.

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  3. 3
    Flip-Chip Mounting of an RF IC using Eutectic Solder Bumps

    Flip-Chip Mounting of an RF IC using Eutectic Solder Bumps by Baggerman, A.F.J., Caers, J.F.J.M., Wagemans, A.G.

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  4. 4
    Hardness reduction of Au bumps for tab interconnections

    Hardness reduction of Au bumps for tab interconnections by Baggerman, A.F.J., Kessels, F.J.H.

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  5. 5
    Reliable Au-Sn flip-chip bonding on flexible prints

    Reliable Au-Sn flip-chip bonding on flexible prints by Baggerman, A.F.J., Batenburg, M.J.

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  6. 6
    TAB inner lead gang bonding on Ni-Au bumps

    TAB inner lead gang bonding on Ni-Au bumps by Baggerman, A.F.J., van Gerven, J.A.H.

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  7. 7
    Reliable Au-Sn flip chip bonding on flexible prints

    Reliable Au-Sn flip chip bonding on flexible prints by Baggerman, A.F.J., Batenburg, M.J.

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  8. 8
    Low-cost flip-chip on board

    Low-cost flip-chip on board by Baggerman, A.F.J., Caers, J.F.J.M., Wondergem, J.J., Wagemans, A.G.

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  9. 9
    Inner lead gang-bonded devices with stacked Ni-Au bumps

    Inner lead gang-bonded devices with stacked Ni-Au bumps by Baggerman, A.F.J., van Gerven, J.A.H.

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