Leveler Effect and Oscillatory Behavior during Copper Electroplating by Huang, Q., Baker-O'Neal, B. C., Parks, C., Hopstaken, M., Fluegel, A., Emnet, C., Arnold, M., Mayer, D.

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Enhanced Grain Growth of Electroplated Copper on Cobalt-Containing Seed Layer by Huang, Q., Baker-O'Neal, B. C., Cabral, C., Simonyi, E., Deline, V. R., Hopstaken, M.

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Suppressor Effects during Copper Superfilling of Sub-100 nm Lines by Huang, Q., Baker-O’Neal, B. C., Kelly, J. J, Broekmann, P., Wirth, A., Emnet, C., Martin, M., Hahn, M., Wagner, A., Mayer, D.

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Electrodeposition of Cu on Ta-Based Layer by Kelly, J. J., Zheng, M., Deligianni, H., Baker-O’Neal, B. C., Cabral, C.

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Development of transmon qubits solely from optical lithography on 300 mm wafers by Foroozani, N, Hobbs, C, Hung, C C, Olson, S, Ashworth, D, Holland, E, Malloy, M, Kearney, P, O'Brien, B, Bunday, B, DiPaola, D, Advocate, W, Murray, T, Hansen, P, Novak, S, Bennett, S, Rodgers, M, Baker-O'Neal, B, Sapp, B, Barth, E, Hedrick, J, Goldblatt, R, Rao, S S Papa, Osborn, K D

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(Invited) Materials and Processes for Superconducting Qubits and Superconducting Electronic Circuits on 300mm Wafers by Papa Rao, Satyavolu S., Hobbs, Christopher, Olson, Stephen, Foroozani, Neda, Chong, Hyuncher, Stamper, Harlan, Martinick, Brian, Ashworth, Dominic, Bunday, Benjamin, Malloy, Matthew, Holland, Eric, Nalaskowski, Jakub, Kearney, Patrick, Ngai, Tat, Wells, Ilyssa, Yakimov, Michael, Oktyabrsky, Serge, O'Brien, Brendan, Kaushik, Vidya, Dunn, Kathleen A, Beckmann, Karsten, Bennett, Stephen, Rodgers, Martin, Murray, Thomas, Novak, Steven, Baker-O'Neal, Brett, Borst, Christopher, Osborn, Kevin D, Liehr, Michael

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Electromigration Reliability of Advanced Interconnects by Hu, C-K, Gignac, L M, Baker-O'Neal, B, Liniger, E, Yu, R, Flaitz, P, Stamper, A K

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Impurities in the Electroplated sub-50 nm Cu Lines: The Effects of the Plating Additives by Huang, Q., Avekians, A., Ahmed, S., Parks, C., Baker-O'Neal, B., Kitayaporn, S., Sahin, A., Sun, Y., Cheng, T.

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Development of transmon qubits solely from optical lithography on 300mm wafers by oozani, N, Hobbs, C, Hung, C C, Olson, S, Ashworth, D, Holland, E, Malloy, M, Kearney, P, O'Brien, B, Bunday, B, DiPaola, D, Advocate, W, Murray, T, Hansen, P, Novak, S, Bennett, S, Rodgers, M, Baker-O'Neal, B, Sapp, B, Barth, E, Hedrick, J, Goldblatt, R, Papa Rao, S S, Osborn, K D

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Lower Resistance Scaled Metal Contacts to Silicide for Advanced CMOS by Ieong, M., Sung, C.Y., Deshpande, S., Chen, X., Deligianni, L., Cohen, S., Brodsky, C., Allen, S., Ouyang, C., Li, Y., Haran, B., Simon, A., Baker-O'Neal, B., Yang, C.-C., Rossnagel, S., Knarr, R., Shao, X., Wong, K., Sheraw, C., Topol, A.

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