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Search Results - Baradanahalli Kenchappa, Nandan
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Investigation of the Impact of Pad Surface Texture from Different Pad Conditioners on the CMP Performance
by
Khanna, Aniruddh J.
,
Yamamura, Mayu
,
Kakireddy, Veera Raghava
,
Chockalingam, Ashwin
,
Jawali, Puneet
,
Baradanahalli Kenchappa, Nandan
,
Hariharan, Venkat
,
Redfield, Daniel
,
Bajaj, Rajeev
Published in
ECS journal of solid state science and technology
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High-Performance Pad Conditioning (HPPC) Arm for Augmenting CMP Performance
by
Khanna, Aniruddh J.
,
Kakireddy, Veera Raghava
,
Fung, Jason
,
Jawali, Puneet
,
Yamamura, Mayu
,
Baradanahalli Kenchappa, Nandan
,
Hariharan, Venkat
,
Redfield, Daniel
,
Bajaj, Rajeev
Published in
ECS journal of solid state science and technology
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Engineering Surface Texture of Pads for Improving CMP Performance of Sub-10 nm Nodes
by
Khanna, Aniruddh J.
,
Kakireddy, Veera Raghava
,
Fung, Jason
,
Yamamura, Mayu
,
Jawali, Puneet
,
Chockalingam, Ashwin
,
Baradanahalli Kenchappa, Nandan
,
Redfield, Daniel
,
Bajaj, Rajeev
Published in
ECS journal of solid state science and technology
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Peer Reviewed
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Ecs Journal Of Solid State Science And Technology
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Subjects
Chemical Mechanical Planarization
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Chemical Mechanical Polishing
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Cmp
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Materials Science
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Materials Science, Multidisciplinary
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Microelectronics - Semiconductor Processing
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Physical Sciences
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Physics
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Physics, Applied
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Science & Technology
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Technology
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Cmp Pad
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Cmp Pad Surface Roughness
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Material Removal Rate
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Pad Conditioner
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Pad Conditioning
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Pad Surface Texture
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Surface Roughness
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Surface Texture
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Institute Of Physics
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Institute Of Physics Iopscience Extra
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