Search Results - Bauer, C.E.
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Foreword Three-Dimensional Packaging
Published in IEEE transactions on advanced packagingGet full text
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Advanced Opportunity Cost Analysis of 3D Packaging Technologies
Conference Proceeding -
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Embedded Chip Build-Up in a Wafer-Level Packaging Environment
Conference Proceeding -
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Micro/chip scale packages and the semiconductor industry road map
Conference Proceeding -
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Emerging technologies; impetus for future high technology growth
Conference Proceeding