Search Results - Becker, Wiren D.

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  1. 1
    Package Power Distribution Current Density in Applications with Large Transient Currents

    Package Power Distribution Current Density in Applications with Large Transient Currents by Doyle, Matthew, Becker, Wiren D., Cocchini, Matteo, Schoneck, Kyle, Connor, Samuel, Berge, Layne, Bai, Siqi, Drewniak, James

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  2. 2
    Broadside-Coupled Differential Routing In Package Via Pin-Field Design

    Broadside-Coupled Differential Routing In Package Via Pin-Field Design by Zhang, Yanyan, Walls, Lloyd, Bohra, Mahesh, Tang, Junyan, Yang, Xianbo, Becker, Wiren D., Dreps, Daniel M.

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  3. 3
    Far End Crosstalk Mitigation of Differential High Speed Interconnects Within Printed Circuit Board Via Fields

    Far End Crosstalk Mitigation of Differential High Speed Interconnects Within Printed Circuit Board Via Fields by Tang, Junyan, Yang, Xianbo, Hejase, Jose A., Bohra, Mahesh, Zhang, Yanyan, Duan, Xiaomin, Kaller, Dierk, Becker, Wiren D., Dreps, Daniel M.

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  4. 4
    RX Equalization for a High-Speed Channel based on Bayesian Active Learning using Dropout

    RX Equalization for a High-Speed Channel based on Bayesian Active Learning using Dropout by Yang, Xianbo, Tang, Junyan, Torun, Hakki M., Becker, Wiren D., Hejase, Jose A., Swaminathan, Madhavan

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  5. 5
    Parallel Bayesian Active Learning using Dropout for Optimizing High-Speed Channel Equalization

    Parallel Bayesian Active Learning using Dropout for Optimizing High-Speed Channel Equalization by Yang, Xianbo, Torun, Hakki M., Tang, Junyan, Paladhi, Pavel Roy, Zhang, Yanyan, Becker, Wiren D., Hejase, Jose A., Swaminathan, Madhavan

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  6. 6
    Signal Integrity Characterization of Channels With Asymmetric Via Stubs

    Signal Integrity Characterization of Channels With Asymmetric Via Stubs by Zhang, Yanyan, Bohra, Mahesh, Pham, Nam, Paladhi, Pavel R., Becker, Wiren D., Dreps, Daniel M.

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  7. 7
    Signal Integrity Considerations of PCB Wiring in Tightly Pitched Module Pin Fields of High Speed Channels

    Signal Integrity Considerations of PCB Wiring in Tightly Pitched Module Pin Fields of High Speed Channels by Myers, Joshua C., Hejase, Jose A., Tang, Junyan, Chun, Sungjun, Becker, Wiren D., Dreps, Daniel M.

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  8. 8
    Effect and Sensitivity of Postcursor FFE in a 25 Gb/s High Speed Bus Channel

    Effect and Sensitivity of Postcursor FFE in a 25 Gb/s High Speed Bus Channel by Paladhi, Pavel Roy, Jayaraman, Prasanna, Pham, Nam, Hejase, Jose, Zhang, Yanyan, Tang, Junyan, Myers, Joshua, Chun, Sungjun, Becker, Wiren D., Dreps, Daniel

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  9. 9
    An Approach For Tuning Signal Integrity Properties Of Edge Card Connectors With Conductive Fixture In High-Speed Link Channels

    An Approach For Tuning Signal Integrity Properties Of Edge Card Connectors With Conductive Fixture In High-Speed Link Channels by Zhang, Yanyan, Hejase, Jose A., Bohra, Mahesh, Paladhi, Pavel R., Shan, Lei, Chun, Sungjun, Audet, Jean J., Becker, Wiren D., Dreps, Daniel M.

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  10. 10
    Vertical and Horizontal Transitions of Substrate Integrated Waveguides Within a Multi-Layered PCB for High Speed Signaling Applications

    Vertical and Horizontal Transitions of Substrate Integrated Waveguides Within a Multi-Layered PCB for High Speed Signaling Applications by Myers, Joshua C., Hejase, Jose A., Tang, Junyan, Paladhi, Pavel R., Becker, Wiren D., Chun, Sungjun, Dreps, Daniel M.

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  11. 11
    High-speed bus signal integrity compliance using a frequency-domain model

    High-speed bus signal integrity compliance using a frequency-domain model by Win, Si T., Hejase, Jose, Becker, Wiren D., Wiedemeier, Glen, Dreps, Daniel M., Myers, Joshua C., Willis, Ken, Horner, John, Varma, Ambrish

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  12. 12
    When are transmission-line effects important for on-chip interconnections?

    When are transmission-line effects important for on-chip interconnections? by Deutsch, A., Kopcsay, G.V., Restle, P.J., Smith, H.H., Katopis, G., Becker, W.D., Coteus, P.W., Surovic, C.W., Rubin, B.J., Dunne, R.P., Gallo, T., Jenkins, K.A., Terman, L.M., Dennard, R.H., Sai-Halasz, G.A., Krauter, B.L., Knebel, D.R.

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  13. 13
    Bayesian Active Learning for Uncertainty Quantification of High Speed Channel Signaling

    Bayesian Active Learning for Uncertainty Quantification of High Speed Channel Signaling by Torun, Hakki M., Hejase, Jose A., Tang, Junyan, Beckert, Wiren D., Swaminathan, Madhavan

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  14. 14
    Analysis of electrical power in IBM POWER9 direct-attached memory subsystem

    Analysis of electrical power in IBM POWER9 direct-attached memory subsystem by Lingambudi, Anil, Pardeik, Michael, Manjunath, Sharath, Becker, Wiren D.

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  15. 15
    A Comprehensive Signal Integrity Study of Differential Pairs Routed within a PCB Via Field

    A Comprehensive Signal Integrity Study of Differential Pairs Routed within a PCB Via Field by Tang, Junyan, Hejase, Jose A., RoyPaladhi, Pavel, Beckir, Wiren D., Dreps, Daniel M.

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  16. 16
    Timing margin analysis and Power measurement with DDR4 memory

    Timing margin analysis and Power measurement with DDR4 memory by Lingambudi, Anil, Vijay, Siddharth, Becker, Wiren D., Pardeik, Michael

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  17. 17
    3D Electromagnetic Modelling of Connector to PCB Via Transitions

    3D Electromagnetic Modelling of Connector to PCB Via Transitions by Zhang, Yanyan, Hejase, Jose A., Myers, Joshua C., Audet, Jean J., Becker, Wiren D., Dreps, Daniel M.

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  18. 18
    A hybrid land grid array socket connector design for achieving higher signalling data rates

    A hybrid land grid array socket connector design for achieving higher signalling data rates by Hejase, Jose A., Chun, Sungjun, Becker, Wiren D., Dreps, Daniel M., Beaman, Brian S.

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  19. 19
    Improve timing margins on multi-rank DDR3 RDIMM using read-on die termination sequencing

    Improve timing margins on multi-rank DDR3 RDIMM using read-on die termination sequencing by Lingambudi, Anil, Vijay, Siddharth, Becker, Wiren D., Raghavendra, Preetham, Sethuraman, Saravanan, Pullelli, Sivarama

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  20. 20
    First- and second-level packaging for the IBM eServer z900

    First- and second-level packaging for the IBM eServer z900 by Harrer, H., Pross, H., Winkel, T.-M., Becker, W. D., Stoller, H. I., Yamamoto, M., Abe, S., Chamberlin, B. J., Katopis, G. A.

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