Search Results - Belisle, Chuck

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  1. 1
    Via resistance increase accelerated by thermal stress

    Via resistance increase accelerated by thermal stress by Qin, Wentao, Donaldson, Scott, Rogers, Dan, Belisle, Chuck, Grivna, Gordy, Boukhanfra, Lahcen, Thiefain, Julien, Barrientos, Denise, Steinwall, Jim, Chang, George, Gambino, Jeff, Burgin, Rebecca

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  2. 2
    Lithography Solutions for a 0.35μm 25V PDMOS Technology

    Lithography Solutions for a 0.35μm 25V PDMOS Technology by Williams, B., Thomason, M., Belisle, C., Greenwood, B.

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    RDL manufacturing for flip chip packaging

    RDL manufacturing for flip chip packaging by Williams, B., Florence, D., Dalal, H., Gunturu, K., Nelson, M., Belisle, C.

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