Search Results - Bi, Billie Xianghong

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  1. 1
    Optimization of Epoxy Molding Compound for Cu wire HTRB Robustness

    Optimization of Epoxy Molding Compound for Cu wire HTRB Robustness by Garete, April Joy, Li, Zhiwen, Bi, Billie Xianghong, Funke, Hans-Juergen, Lee, Kwong Cheung, Chen, Haibin

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    Evaluation on Wedge Bond Performance of Different Cu Wire Types during Thermal Cycling Test (IMPACT 2020)

    Evaluation on Wedge Bond Performance of Different Cu Wire Types during Thermal Cycling Test (IMPACT 2020) by Bi, Billie Xianghong, Funke, Hans-Juergen, Lam, Wai, Chen, Haibin

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