Search Results - Bickford, Jeanne P

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  1. 1
    Editorial

    Editorial by Bickford, Jeanne P., Djurdjanovic, Dragan, Natarajan, Mahadeva Iyer

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  2. 2
    Editorial

    Editorial by Bickford, Jeanne P., Djurdjanovic, Dragan, Natarajan, Mahadeva Iyer

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  3. 3
    Composite attribute method and software to interlock semiconductor product design and manufacturing yield

    Composite attribute method and software to interlock semiconductor product design and manufacturing yield by Bickford, Jeanne P., Rolfing, Lori, Sullivan, Candance, They, Carlos, Wolf, Edward M., Yoder, Joseph W., Niekrewicz, Paul

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  4. 4
    Terminal metal inspection yield improvement YE: Yield enhancement

    Terminal metal inspection yield improvement YE: Yield enhancement by Bickford, Jeanne P.

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  5. 5
    Improved yield through use of a Scalable Parametric Measurement macro

    Improved yield through use of a Scalable Parametric Measurement macro by Bickford, Jeanne P, Habib, Nazmul, Goss, John R, Bickford, Rebecca A

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  6. 6
    Method and structure to reduce leakage for ESD device: ET/ID: Enabling technologies and innovative devices

    Method and structure to reduce leakage for ESD device: ET/ID: Enabling technologies and innovative devices by Ginawi, Ahmed Y., Habib, Nazmul, Muhammad, Mujahid, Bickford, Jeanne P.

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  7. 7
    Product Yield Prediction System and Critical Area Database

    Product Yield Prediction System and Critical Area Database by Barnett, T.S., Bickford, J.P., Weger, A.J.

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  8. 8
    Product Yield Prediction System and Critical Area Database : Advanced semiconductor manufacturing conference

    Product Yield Prediction System and Critical Area Database : Advanced semiconductor manufacturing conference by BARNETT, Thomas S, BICKFORD, Jeanne P, WEGER, Alan J

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  9. 9
    SRAM Redundancy - Silicon Area versus Number of Repairs Trade-off

    SRAM Redundancy - Silicon Area versus Number of Repairs Trade-off by Bickford, J.P., Rosner, R., Hedberg, E., Yoder, J.W., Barnett, T.S.

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  10. 10
    Optimizing product yield using manufacturing defect weights

    Optimizing product yield using manufacturing defect weights by Bickford, J. P., Hibbeler, J. D., Mueller, D., Peyer, Sven, Kumar, Vasanth S.

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  11. 11
    Accurate chip leakage prediction: Challenges and solutions

    Accurate chip leakage prediction: Challenges and solutions by Xiaojun Yu, Jie Deng, Sim Loo, Dezfulian, K., Lichtensteiger, S., Bickford, J., Habib, N., Chang, P., Mocuta, A., Rim, Ken

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  12. 12
    Circuit-dependent FMAX, Power and Process optimization to improve product Reliability, Availability and Serviceability

    Circuit-dependent FMAX, Power and Process optimization to improve product Reliability, Availability and Serviceability by Nsame, P., Nadkarni, R., Klazynski, J. N., Bickford, J., Sumner, K., Susso, B., Kumar, R., Bazan, G., Polson, A., Radaker, R.

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  13. 13
    Yield optimization for third party library elements

    Yield optimization for third party library elements by Bickford, J. P., Chan, F., Styduhar, M., Lee Wang, Arelt, R., Graur, I., Parker, S., Ryan, D., Wagner, T., Kumaraswamy, A.

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  14. 14
    Statistical Evaluation of Electromigration Reliability at Chip Level

    Statistical Evaluation of Electromigration Reliability at Chip Level by Baozhen Li, McLaughlin, P S, Bickford, J P, Habitz, P, Netrabile, D, Sullivan, T D

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