On the Small-Signal Capacitance of RF MEMS Switches at Very Low Frequencies by Jiahui Wang, Bielen, Jeroen, Salm, Cora, Krijnen, Gijs, Schmitz, Jurriaan

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Numerical Path Following as an Analysis Method for Electrostatic MEMS by Stulemeijer, J., Bielen, J.A., Steeneken, P.G., van den Berg, J.B.

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Spring-constant measurement methods for RF-MEMS capacitive switches by Jiahui Wang, Bielen, Jeroen, Salm, Cora, Schmitz, Jurriaan

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Delamination and solder flowout in underfilled and Pbfree flip chips on laminate by van Kleef, Marc, Bielen, Jeroen, Glpen, Jan, Ramos, Mike

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Delamination and solder flow-out in underfilled and Pb-free flip chips on laminate by van Kleef, Marc, Bielen, Jeroen, Gülpen, Jan, Ramos, Mike

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Evaluation of Creep in RF MEMS Devices by van Gils, M., Bielen, J., McDonald, G.

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Prediction of high cycle fatigue in aluminum bond wires: A physics of failure approach combining experiments and multi-physics simulations by Bielen, J., Gommans, J.-J., Theunis, F.

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Efficient electrostatic-mechanical modeling of C-V curves of RF-MEMS switches by Bielen, J., Stulemeijer, J.

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Fluid-electrostatic-mechanical modeling of the dynamic response of RF-MEMS capacitive switches by Bielen, J., Stulemeijer, J., Ganjoo, D., Ostergaard, D., Noijen, S.

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Die fracture probability prediction and design guidelines for laminate-based over-molded packages by Daoguo Yang, Bielen, J., Theunis, F., van Driel, W.D., Zhang, G.Q.

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The effect of cyclic hardening in copper heat-sinks on die fracture probability by Bielen, J., van Gils, M., Theunis, F.

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Neuro-electronic interfacing with multielectrode arrays by Rutten, W.L.C., Smit, J.P.A., Frieswijk, T.A., Bielen, J.A., Brouwer, A.L.H., Buitenweg, J.R., Heida, C.

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