Search Results - Boon Howe Oh

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  1. 1
    CPU Package Design Optimization for Performance Improvement and Package Cost reduction

    CPU Package Design Optimization for Performance Improvement and Package Cost reduction by Howe Yin Loo, Boon Howe Oh, Poh Tat Oh, Eng Kwong Lee

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  2. 2
    Package Routing and Thermal Analysis on a Multi-Chip Package (MCP)

    Package Routing and Thermal Analysis on a Multi-Chip Package (MCP) by Boon Howe Oh, Eng Kwong Lee, Howe Yin Loo, Poh Tat Oh

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  3. 3
    The Evolution of CPU Packaging Technology and Future Challenges

    The Evolution of CPU Packaging Technology and Future Challenges by Boon Howe Oh, Eng Kwong Lee, Howe Yin Loo, Poh Tat Oh

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  4. 4
    Challenges in Stacked CSP Packaging Technology

    Challenges in Stacked CSP Packaging Technology by Boon Howe Oh, Howe Yin Loo, Poh Tat Oh, Eng Kwong Lee

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  5. 5
    Design and development of thermal-mechanical solutions for a community personal computer

    Design and development of thermal-mechanical solutions for a community personal computer by Zhou, D., Tze Yang Hin, Keat Ghee Tan, Boon Howe Oh

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