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A new investigation of copper's role in enhancing Al–Cu interconnect electromigration resistance from an atomistic view
by
Liu, X.-Y
,
Liu, C.-L
,
Borucki, L.J
Published in
Acta materialia
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Fluid Pressures and Pad Topography in Chemical Mechanical Polishing
by
Borucki, Leonard J.
,
Ng, Sum Huan
,
Danyluk, Steven
Published in
Journal of the Electrochemical Society
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Deposition and etch processes: continuum film evolution in microelectronics
by
Cale, T.S.
,
Rogers, B.R.
,
Merchant, T.P.
,
Borucki, L.J.
Published in
Computational materials science
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Evidence and modeling of anomalous low concentration arsenic inactivation
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Borucki, L.J.
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Conference Proceeding
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