Search Results - Bougataya, M.

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  1. 1
    SoC systems thermal monitoring using embedded sensor cells unit

    SoC systems thermal monitoring using embedded sensor cells unit by Sayde, M., Lakhssassi, A., Bougataya, M., Terkawi, O., Blaquiere, Y.

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  2. 2
    Mixed fluid-heat transfer approach for VLSI steady state thermal analysis

    Mixed fluid-heat transfer approach for VLSI steady state thermal analysis by Bougataya, M., Lakhsasi, A., Savaria, Y., Massicotte, D.

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  3. 3
    Thermal stress monitoring using gradient direction sensors

    Thermal stress monitoring using gradient direction sensors by Lakhssassi, A., Bougataya, M., Boustany, C., Massicotte, D.

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  4. 4
    Silicon-die thermal monitoring using embedded sensor cells unit

    Silicon-die thermal monitoring using embedded sensor cells unit by Sayde, M., Berriah, O., Lakhssassi, A., Bougataya, M., Kengne, E., Talbi, L.

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  5. 5
    VLSI thermal stress monitoring using GDS method

    VLSI thermal stress monitoring using GDS method by Lakhsasi, A., Bougataya, M., Boustany, C., Massicotte, D.

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  6. 6
    Wafer post-processing for a reconfigurable wafer-scale circuit board

    Wafer post-processing for a reconfigurable wafer-scale circuit board by Radji, M., Lakhssassi, A., Bougataya, M., Hamoui, A., Izquierdo, R.

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  7. 7
    Design and implementation of a surface peak thermal detector algorithm

    Design and implementation of a surface peak thermal detector algorithm by Boustany, C., Lakhsasi, A., Bougataya, M.

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  8. 8
    Steady State Thermo-mechanical Stress Prediction for Large VLSI circuits using GDS Method

    Steady State Thermo-mechanical Stress Prediction for Large VLSI circuits using GDS Method by Bougataya, M., Lakhsasi, A., Massicotte, D.

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  9. 9
    Steady state thermal analysis of a reconfigurable wafer-scale circuit board

    Steady state thermal analysis of a reconfigurable wafer-scale circuit board by Bougataya, M., Lakhsasi, A., Norman, R., Prytula, R., Blaquiere, Y., Savaria, Y.

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  10. 10
    VLSI thermo-mechanical stress analysis by gradient direction sensor method

    VLSI thermo-mechanical stress analysis by gradient direction sensor method by Bougataya, M., Lakhsasi, A., Massicotte, D.

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  11. 11
    Thermo-mechanical stress analysis of VLSI devices by partially coupled finite element method

    Thermo-mechanical stress analysis of VLSI devices by partially coupled finite element method by Bougataya, M., Lakhsasi, A., Savaria, Y., Massicotte, D.

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  12. 12
    Stress and distortion behavior for VLSI steady state thermal analysis

    Stress and distortion behavior for VLSI steady state thermal analysis by Bougataya, M., Lakhsasi, A., Savaria, Y., Massicotte, D.

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