Search Results - Bouillard, Boris

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    Plasma Dicing Integration Schemes for Scribe Lane Layout and the Impact on Die Strength

    Plasma Dicing Integration Schemes for Scribe Lane Layout and the Impact on Die Strength by Parker, David, Gourvest, Emmanuel, Bouillard, Boris

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    Cu-SnAg Interconnects Evaluation for the Assembly at 10µm and 5µm Pitch

    Cu-SnAg Interconnects Evaluation for the Assembly at 10µm and 5µm Pitch by Taneja, Divya, Volpert, Marion, Lasfargues, Gilles, Chambion, Bertrand, Bouillard, Boris, Jarjayes, Sylvie, Chaira, Tarik, Vandeneynde, Aureili, Goiran, Yannick, Henry, David, Hodaj, Fiqiri

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