N-halamine surface coating for mitigation of biofilm and microbial contamination in water systems for space travel by Demir, Buket, Taylor, Alicia, Broughton, R.M., Huang, T.-S., Bozack, M.J., Worley, S.D.

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Polymeric Antimicrobial N‑Halamine-Surface Modification of Stainless Steel by Demir, Buket, Broughton, R. M, Huang, T. S, Bozack, M. J, Worley, S. D

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Anisotropic Mechanical Properties of SAC Solder Joints in Microelectronic Packaging and Prediction of Uniaxial Creep Using Nanoindentation Creep by Hasnine, M., Suhling, J.C., Prorok, B.C., Bozack, M.J., Lall, P.

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Methods for fast, reliable growth of Sn whiskers by Bozack, M.J., Snipes, S.K., Flowers, G.N.

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Influence of Substrate Surface Roughness on Tin Whisker Growth by Rodekohr, C.L., Flowers, G.T., Suhling, J.C., Bozack, M.J.

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A study of the physical characteristics of vibration-induced fretting corrosion by Flowers, G.T., Fei Xie, Bozack, M.J., Xin Hai, Rickett, B.I., Malucci, R.D.

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Vibration thresholds for fretting corrosion in electrical connectors by Flowers, G.T., Fei Xie, Bozack, M.J., Malucci, R.D.

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The Influence of Elevated Temperature Aging on Reliability of Lead Free Solder Joints by Hongtao Ma, Suhling, J.C., Yifei Zhang, Lall, P., Bozack, M.J.

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Wetting characteristics of Pb-free solder alloys and PWB finishes by Sattiraju, S.V., Bing Dang, Johnson, R.W., Yali Li, Smith, J.S., Bozack, M.J.

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Modeling early stage fretting of electrical connectors subjected to random vibration by Flowers, G.T., Fei Xie, Bozack, M.J., Horvath, R., Malucci, R.D., Rickett, B.I.

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Surface Studies on SiC as Related to Contacts by Bozack, M. J.

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Reliability Performance of Lead–Free SAC Solder Joints on Electroless Ni/Immersion Au and Electroless Ni/Electroless Pd/Immersion Au Subject to Long–Term Isothermal Aging by Hai, Zhou, Zhang, Jiawei, Shen, Chaobo, Snipes, E.K., Bozack, M.J., Evans, J.L., Suhling, J.C.

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The effects of exposure temperature on 2219 AlCu alloy surfaces immersed in natural seawater by Bozack, M.J., Beshears, R.D.

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Chemical activity of the CC double bond on silicon surfaces by Bozack, M.J., Taylor, P.A., Choyke, W.J., Yates, J.T.

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Si-F bond directions on Si(100) — A study by ESDIAD by Bozack, M.J., Dresser, M.J., Choyke, W.J., Taylor, P.A., Yates, J.T.

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Defect- and electron-enhanced chemistry at silicon surfaces: Reactivity and thermal desorption of propylene on Si(100)-(2 × 1) by Bozack, M.J., Choyke, W.J., Muehlhoff, L., Yates, J.T.

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Effect of (Au, Ni)Sn 4 Evolution on Sn-37Pb/ENIG Solder Joint Reliability Under Isothermal and Temperature-Cycled Conditions by Davis, J.A, Bozack, M.J, Evans, J.L

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Auger Electron Spectroscopic (AES) Measurements on High Aspect Ratio Tin Whiskers by Rodekohr, C.L., Flowers, G.T., Suhling, J.C., Bozack, M.J.

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The effects of aging temperature on SAC solder joint material behavior and reliability by Yifei Zhang, Zijie Cai, Suhling, J.C., Lall, P., Bozack, M.J.

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The Effect of Initial Connector Insertions on Electrical Contact Resistance by Jackson, R.L., Ashurst, W.R., Flowers, G.T., Angadi, S., Song-yul Choe, Bozack, M.J.

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