Search Results - Bressers, R.J.L.

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    Reliability of flip chip on board. First order model for the effect on contact integrity of moisture penetration in the underfill

    Reliability of flip chip on board. First order model for the effect on contact integrity of moisture penetration in the underfill by Caers, J.F.J.M., Oesterholt, R., Bressers, R.J.L., Mouthaan, T.J., Verweij, J.F.

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