Search Results - Brizoux, Michel

  • Showing 1 - 8 results of 8
Refine Results
  1. 1
    Cyclic mechanical behaviour of Sn3.0Ag0.5Cu alloy under high temperature isothermal ageing

    Cyclic mechanical behaviour of Sn3.0Ag0.5Cu alloy under high temperature isothermal ageing by Dompierre, B., Aubin, V., Charkaluk, E., Filho, W.C. Maia, Brizoux, M.

    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  2. 2
    Thermal ageing induces drastic changes on mechanical and damage behavior of Sn3.0Ag0.5Cu alloy

    Thermal ageing induces drastic changes on mechanical and damage behavior of Sn3.0Ag0.5Cu alloy by Dompierre, Benoît, Maia Filho, Wilson Carlos, Brizoux, Michel, Aubin, Véronique, Charkaluk, Eric

    Get full text
    Article
    Save to List
    Saved in:
  3. 3
    Influence of thermal ageing on cyclic mechanical properties of SnAgCu alloys for microelectronic assemblies

    Influence of thermal ageing on cyclic mechanical properties of SnAgCu alloys for microelectronic assemblies by Dompierre, B., Aubin, V., Charkaluk, E., Maia Filho, W.C., Brizoux, M.

    Published in Procedia engineering
    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  4. 4
    Improved physical understanding of intermittent failure in continuous monitoring method

    Improved physical understanding of intermittent failure in continuous monitoring method by Filho, W.C. Maia, Brizoux, M., Frémont, H., Danto, Y.

    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  5. 5
    Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards

    Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards by Macurova, Katerina, Angerer, Paul, Schöngrundner, Ronald, Krivec, Thomas, Morianz, Mike, Antretter, Thomas, Bermejo, Raul, Pletz, Martin, Brizoux, Michel, Maia, Wilson

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  6. 6
    Multi-physics simulation of the component attachment within embedding process

    Multi-physics simulation of the component attachment within embedding process by Macurova, K., Kharicha, A., Pletz, M., Mataln, M., Bermejo, R., Schongrundner, R., Krivec, T., Antretter, T., Maia, W., Morianz, M., Brizoux, M.

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  7. 7
    Solder Joint Loading Conditions under Torsion Test

    Solder Joint Loading Conditions under Torsion Test by Maia Filho, W.C., Brizoux, M., Fremont, H., Danto, Y.

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  8. 8
    Evaluation of standard plastic integrated circuits reliability after accelerated sequential testing

    Evaluation of standard plastic integrated circuits reliability after accelerated sequential testing by LEROSE, S, DELEUZE, G, BRIZOUX, M

    Get full text
    Items that this one cites
    Article
    Save to List
    Saved in:

Search Tools: