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Search Results - Brouillette, D.W.
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Area array solder interconnection technology for the three-dimensional silicon cube
by
Howell, W.J.
,
Brouillette, D.W.
,
Konejwa, J.W.
,
Sprogis, E.J.
,
Yankee, S.J.
,
Wursthorn, J.M.
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Conference Proceeding
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Conference Proceedings
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Ceramics
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Fabrication
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Integrated Circuit Interconnections
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Integrated Circuit Technology
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Semiconductor Device Packaging
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Sensor Arrays
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Silicon
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Sputtering
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Thermal Expansion
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Ieee Electronic Library (Iel) Conference Proceedings
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