High-Order Sliding-Mode Controllers of an Electropneumatic Actuator: Application to an Aeronautic Benchmark by Girin, A., Plestan, F., Brun, X., Glumineau, A.

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Systematic control of an electropneumatic system: integrator backstepping and sliding mode control by Smaoui, M., Brun, X., Thomasset, D.

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Higher order sliding mode control based on optimal approach of an electropneumatic actuator by Laghrouche¶, S., Smaoui, M., Plestan, F., Brun, X.

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High-order sliding mode for an electropneumatic system: A robust differentiator-controller design by Smaoui, M., Brun, X., Thomasset, D.

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Pneumatic evoked potential. Sensory or auditive potential? by Condé, S, Créac’h, C, Brun, X, Moreau, R, Convers, P, Peyron, R

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Comparative analysis of pick & place strategies for a multi-robot application by Humbert, G., Pham, M. T., Brun, X., Guillemot, M., Noterman, D.

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W10.5 Pneumatic evoked potential. Auditory and/or somatosensory EPS? by Condé, S, Peyron, R, Créac'h, C, Convers, P, Brun, X

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Quantification of Interfacial Voids Using Positron Annihilation Spectroscopy for Mechanism Study on SiCN Bonding and SiN Bonding by Yang, Y., Brun, X. F., Weber, M. H., Flores, M.

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Design of a New Instrumented Forceps: Application to Safe Obstetrical Forceps Blade Placement by Moreau, Richard, Pham, Minh Tu, Silveira, Ruimark, Redarce, Tanneguy, Brun, Xavier, Dupuis, Olivier

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Enabling Next Generation 3D Heterogeneous Integration Architectures on Intel Process by Elsherbini, A., Jun, K., Liff, S., Talukdar, T., Bielefeld, J., Li, W., Vreeland, R., Niazi, H., Rawlings, B., Ajayi, T., Tsunoda, N., Hoff, T., Woods, C., Pasdast, G., Tiagaraj, S., Kabir, E., Shi, Y., Brezinski, W., Jordan, R., Ng, J., Brun, X., Krisnatreya, B., Liu, P., Zhang, B., Qian, Z., Goel, M., Swan, J., Yin, G., Pelto, C., Torres, J., Fischer, P.

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Assessment of forceps use in obstetrics during a simulated childbirth by Moreau, R., Pham, M. T., Brun, X., Redarce, T., Dupuis, O.

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A study on tracking position control of an electropneumatic system using backstepping design by Smaoui, M., Brun, X., Thomasset, D.

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Selective Epoxy Mold Compound Slurry for Advanced Packaging Technology by Widodo, T. S., Brun, X. F., Tsunoda, N., Ichige, Y., Arata, S., Noda, C., Nomura, S., Kondo, S.

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Selective and Tunable Slurry for Advanced Packaging Epoxy Mold Compound by Arata, Shogo, Noda, Chiaki, Ichige, Yasuhiro, Nomura, Satoyuki, Widodo, T. S., Tsunoda, N., Brun, X. F.

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Same size mold chase technology for effective stack die architectures by Deb, N., Tomita, Y., Brun, X. F., Masuyama, C., Hirano, Y., Hamada, N., Wada, K., Oshida, H., Ganbayashi, K.

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Le potentiel évoqué pneumatique. Potentiel sensoriel ou auditif ? by Peyron, R, Condé, S, Brun, X, Créac’h, C, Convers, P

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300mm Full Thickness Si-Based IC Singulation Using Plasma Dicing for Advanced Packaging Technologies by Surapaneni, R., Hamlin, B. S., Chiu, J., Brun, X. F., Barnett, R., Muggeridge, M., Bhasker, H., Richards, N.

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Thermal History Index as a bulk quality indicator for Czochralski solar wafers by Veirman, J., Martel, B., Letty, E., Peyronnet, R., Raymond, G., Cascant, M., Enjalbert, N., Danel, A., Desrues, T., Dubois, S., Picoulet, C., Brun, X., Bonnard, P.

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Application of sensory analysis to champagne wine characterisation and discrimination by Vannier, Annie, Brun, Olivier X, Feinberg, Max H

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Ultra-thin mold cap for Advanced Packaging Technology by Deb, N., Brun, X. F., Masuyama, C., Hamada, N., Hirano, Y., Wada, K., Oshida, H., Ganbayashi, K., Zhou, L. L., Lu, T. Y.

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