Search Results - Budhwani, Rahul

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  1. 1
    Thermally stable, packaged aware LV HKMG platforms benchmark to enable low power I/O for next 3D NAND generations

    Thermally stable, packaged aware LV HKMG platforms benchmark to enable low power I/O for next 3D NAND generations by Spessot, Alessio, Salahuddin, Shairfe Muhammad, Escobar, Ricardo, Ritzenthaler, Romain, Xiang, Yang, Budhwani, Rahul, Litta, Eugenio Dentoni, Capogreco, Elena, Bastos, Joao, Chen, Yangyin, Naoto, Horiguchi

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    A Comparative Study on the Effects of Pooling on FER CNN Models

    A Comparative Study on the Effects of Pooling on FER CNN Models by Agrawal, Muskan, Shrivastasva, Padmavati, Pillai, Rahul R., Budhwani, Chirag, Khare, Shivam

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