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Microwave bonding of polymer-based substrates for potential encapsulated micro/nanofluidic device fabrication
by
Lei, Kin Fong
,
Ahsan, Syed
,
Budraa, Nasser
,
Li, Wen J.
,
Mai, John D.
Published in
Sensors and actuators. A. Physical.
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Microwave processing techniques for high density interconnects and hybridization
by
Budraa, N.
,
Boon Ng
,
Wang, D.
,
Ahsan, S.
,
Yu Zhang
,
Cho, E.
,
McQuiston, B.
,
Mai, J.
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Microwave bonding of silicon dies with thin metal films for MEMS applications
by
Clendenin, J.
,
Tung, S.
,
Budraa, N.
,
Mai, J.
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Low pressure and low temperature hermetic wafer bonding using microwave heating
by
Budraa, N.K.
,
Jackson, H.W.
,
Barmatz, M.
,
Pike, W.T.
,
Mai, J.D.
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