Search Results - Bunya, Masaru

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  1. 1
    Applications of copolymer for rapid identification of bacteria in blood culture broths using matrix-assisted laser desorption ionization time-of-flight mass spectrometry

    Applications of copolymer for rapid identification of bacteria in blood culture broths using matrix-assisted laser desorption ionization time-of-flight mass spectrometry by Ashizawa, Kazuho, Murata, Syota, Terada, Takashi, Ito, Daisuke, Bunya, Masaru, Watanabe, Koji, Teruuchi, Yoko, Tsuchida, Sachio, Satoh, Mamoru, Nishimura, Motoi, Matsushita, Kazuyuki, Sugama, Yuji, Nomura, Fumio

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  2. 2
    Correlation between Filled Via and Produced Cuprous Ion Concentration by Reverse Current Waveform

    Correlation between Filled Via and Produced Cuprous Ion Concentration by Reverse Current Waveform by Hayashi, Taro, Kondo, Kazuo, Saito, Takeyasu, Okamoto, Naoki, Yokoi, Masayuki, Takeuchi, Minoru, Bunya, Masaru, Marunaka, Masao, Tsuchiya, Takayuki

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  3. 3
    Application of MCD Spectroscopy and TD-DFT to Nonplanar Core-Modified Tetrabenzoporphyrins: Effect of Reduced Symmetry on Nonplanar Porphyrinoids

    Application of MCD Spectroscopy and TD-DFT to Nonplanar Core-Modified Tetrabenzoporphyrins: Effect of Reduced Symmetry on Nonplanar Porphyrinoids by Mack, John, Bunya, Masaru, Shimizu, Yusuke, Uoyama, Hiroki, Komobuchi, Naoki, Okujima, Tetsuo, Uno, Hidemitsu, Ito, Satoshi, Stillman, Martin J., Ono, Noboru, Kobayashi, Nagao

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  4. 4
    Effect of Basicity of Amino Group at Side Chain in Diallylamine-Type Copolymer Additive on Via-Filling by Copper Electrodeposition

    Effect of Basicity of Amino Group at Side Chain in Diallylamine-Type Copolymer Additive on Via-Filling by Copper Electrodeposition by Yamada, Yasutaka, Kondo, Kazuo, Takeuchi, Minoru, Okamoto, Naoki, Saito, Takeyasu, Bunya, Masaru, Yokoi, Y.

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  5. 5
    Effect of Counter Ions in a Diallylamine-type Copolymer Additive on Via-filling by Copper Electrodeposition

    Effect of Counter Ions in a Diallylamine-type Copolymer Additive on Via-filling by Copper Electrodeposition by TAKEUCHI, Minoru, ANAMI, Yoshihiro, YAMADA, Yasutaka, BUNYA, Masaru, OKADA, Shoko, OKAMOTO, Naoki, SAITO, Takeyasu, YOKOI, Masayuki, KONDO, Kazuo

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  6. 6
    Via Filling Electrodeposotion of 4μm Diameter Via by Periodical Reverse Current

    Via Filling Electrodeposotion of 4μm Diameter Via by Periodical Reverse Current by Hayashi, Taro, Kondo, K., Takeuchi, Minoru, Saito, Takeyasu, Okamoto, Naoki, Bunya, Masaru, Yokoi, Masayuki

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  7. 7
    (Invited) High Speed Copper Electrodeposition for Through Silicon Via(TSV)

    (Invited) High Speed Copper Electrodeposition for Through Silicon Via(TSV) by Hayashi, Taro, Kondo, Kazuo, Takeuchi, Minoru, Suzuki, Yushi, Saito, Takeyasu, Okamoto, Naoki, Marunaka, Masao, Tsuchiya, Takayuki, Bunya, Masaru

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  8. 8
    Single Diallylamine Type Copolymer Additive which Perfectly Fills Cu Electrodeposition with only 1ppm

    Single Diallylamine Type Copolymer Additive which Perfectly Fills Cu Electrodeposition with only 1ppm by Takeuchi, Minoru, Kondo, Kazuo, Kuri, Hideyuki, Bunya, Masaru, Okamoto, Naoki, Saito, Takeyasu

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  9. 9
    3D interconnected technology by high speed copper electrodeposition using diallylamine levelers

    3D interconnected technology by high speed copper electrodeposition using diallylamine levelers by Hayashi, T., Kondo, K., Takeuchi, M., Suzuki, Y., Saito, T., Okamoto, N., Marunaka, M., Tsuchiya, T., Bunya, M.

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  10. 10
    Small diameter via filling electrodeposition by periodical reverse current

    Small diameter via filling electrodeposition by periodical reverse current by Hayashi, Taro, Kondo, Kazuo, Saito, Takeyasu, Okamoto, Naoki, Yokoi, Masayuki, Takeuchi, Minoru, Bunya, Masaru, Marunaka, Masao, Tsuchiya, Takayuki

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