Search Results - Buschick, K.

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  1. 1
    Switchable polymer-based thin film coils as a power module for wireless neural interfaces

    Switchable polymer-based thin film coils as a power module for wireless neural interfaces by Kim, S., Zoschke, K., Klein, M., Black, D., Buschick, K., Toepper, M., Tathireddy, P., Harrison, R., Oppermann, H., Solzbacher, F.

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  2. 2
    Nonlinearity of the refractive index due to an excitonic molecule resonance state in CdS

    Nonlinearity of the refractive index due to an excitonic molecule resonance state in CdS by Baumert, R., Broser, I., Buschick, K.

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  3. 3
    Shear test for adhesion measurement of small structures

    Shear test for adhesion measurement of small structures by Schammler, G., Buschick, K., Hahn, R., Reichl, H.

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  4. 4
    Vacuum ultraviolet photoconductivity of 2,2,4,4,-tetramethylpentane and bis(trimethylsilyl)ethane

    Vacuum ultraviolet photoconductivity of 2,2,4,4,-tetramethylpentane and bis(trimethylsilyl)ethane by Buschick, K., Schmidt, W.F.

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  5. 5
    Embedding technology-a chip-first approach using BCB

    Embedding technology-a chip-first approach using BCB by Topper, M., Buschick, K., Wolf, J., Glaw, V., Hahn, R., Dabek, A., Ehrmann, O., Reichl, H.

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  6. 6
    Laser direct writing of copper on various thin-film substrate materials

    Laser direct writing of copper on various thin-film substrate materials by Müller, Heinrich G., Buschick, Klaus, Schuler, Siegfried, Paredes, Alvaro

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  7. 7
    Polymer based thin film coils as a power module of wireless neural interfaces

    Polymer based thin film coils as a power module of wireless neural interfaces by Kim, S., Buschick, K., Zoschke, K., Klein, M., Toepper, M., Black, D., Harrison, R., Tathireddy, P., Solzbacher, F.

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  8. 8
    Biocompatible hybrid flip chip microsystem integration for next generation wireless neural interfaces

    Biocompatible hybrid flip chip microsystem integration for next generation wireless neural interfaces by Topper, M., Klein, M., Buschick, K., Glaw, V., Orth, K., Ehrmann, O., Hutter, M., Oppermann, H., Becker, K.-F., Braun, T., Ebling, F., Reichl, H., Kim, S., Tathireddy, P., Chakravarty, S., Solzbacher, F.

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  9. 9
    Stackable thin film multi layer substrates with integrated passive components

    Stackable thin film multi layer substrates with integrated passive components by Zoschke, K., Buschick, K., Scherpinski, K., Fischer, T., Wolf, J., Ehrmann, O., Jordan, R., Reichl, H., Schmiickle, F.-J.

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