Search Results - Busek, D

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  1. 1
    Analysis of no-clean flux spatter during the soldering process

    Analysis of no-clean flux spatter during the soldering process by Veselý, P., Bušek, D., Krammer, O., Dušek, K.

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  2. 2
    Problem with no-clean flux spattering on in-circuit testing pads diagnosed by EDS analysis

    Problem with no-clean flux spattering on in-circuit testing pads diagnosed by EDS analysis by Dusek, K, Busek, D

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  3. 3
    Flux effect on void quantity and size in soldered joints

    Flux effect on void quantity and size in soldered joints by Bušek, D., Dušek, K., Růžička, D., Plaček, M., Mach, P., Urbánek, J., Starý, J.

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  4. 4
    Influence of vapor phase soldering fluid Galden on wetting forces (tombstone effect)

    Influence of vapor phase soldering fluid Galden on wetting forces (tombstone effect) by Dušek, K., Bušek, D., Plaček, M., Géczy, Attila, Krammer, Olivér, Illés, Balázs

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  5. 5
    Diagnostics of photovoltaic power plant operating

    Diagnostics of photovoltaic power plant operating by Machacek, Z, Benda, V, Busek, D

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  6. 6
    Comparison of shear strength of soldered SMD resistors for various solder alloys

    Comparison of shear strength of soldered SMD resistors for various solder alloys by Dusek, K., Busek, D., Beran, T., Rudajevova, A.

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  7. 7
    Surface finish influence on PCB contamination by flux spattering effect

    Surface finish influence on PCB contamination by flux spattering effect by Dusek, K., Busek, D., Slavata, M., Rudajevova, A.

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  8. 8
    Study of glass transition temperature of electrically conductive adhesives

    Study of glass transition temperature of electrically conductive adhesives by Busek, D., Mach, P.

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  9. 9
    Electrical connection network within an electrically conductive adhesive

    Electrical connection network within an electrically conductive adhesive by Busek, D., Mach, P.

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  10. 10
    Modification of interfacial properties between filler particles in electrically conductive adhesives

    Modification of interfacial properties between filler particles in electrically conductive adhesives by Mach, P., Busek, D.

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  11. 11
    Correlations between mechanical and electrical parameters of modified electrically conductive adhesives

    Correlations between mechanical and electrical parameters of modified electrically conductive adhesives by Busek, D., Selepova, J., Mach, P.

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  12. 12
    Influence of carbon nanotubes added to a commercial adhesive

    Influence of carbon nanotubes added to a commercial adhesive by Busek, D., Mach, P.

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  13. 13
    Modification of adhesive joints resistance with current pulses

    Modification of adhesive joints resistance with current pulses by Mach, P, Busek, D

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  14. 14
    Measurement of Conductive connections and joints using current noise evaluation

    Measurement of Conductive connections and joints using current noise evaluation by Papez, V., Busek, D.

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  15. 15
    Influence of interconnection surface finishes on quality of adhesive joints

    Influence of interconnection surface finishes on quality of adhesive joints by Mach, P., Busek, D., Duraj, A.

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  16. 16
    Thermomechanical analysis of electrically conductive adhesives

    Thermomechanical analysis of electrically conductive adhesives by Mach, P, Busek, D, Polansky, R

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  17. 17
    Can conductive adhesives with nanoparticles beat commonly used electrically conductive adhesives without nanoparticles?

    Can conductive adhesives with nanoparticles beat commonly used electrically conductive adhesives without nanoparticles? by Busek, D., Radev, R., Mach, P.

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  18. 18
    Mathematically simulated process of evaporation of thin NiCr films

    Mathematically simulated process of evaporation of thin NiCr films by Mach, P., Rozkosny, T., Busek, D.

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  19. 19
    Viscosity of Polymer Paste Materials for Electronics

    Viscosity of Polymer Paste Materials for Electronics by Pelikanova, I.B., Tucan, M., Busek, D.

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  20. 20
    Measurement of Nonlinearity as a Diagnostic Tool for Quality Determination of Lead-free Solder Joints

    Measurement of Nonlinearity as a Diagnostic Tool for Quality Determination of Lead-free Solder Joints by Duraj, A., Busek, D., Mlich, A.

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