Search Results - Byeung-Gee Kim

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  1. 1
    Highly reliable, fine pitch chip on glass (COG) joints fabricated using Sn/Cu bumps and non-conductive adhesives

    Highly reliable, fine pitch chip on glass (COG) joints fabricated using Sn/Cu bumps and non-conductive adhesives by Kim, Byeung-Gee, Lee, Sang-Mok, Jo, Yun-Song, Kim, Sun-Chul, Harr, Kyoung-Moo, Kim, Young-Ho

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  2. 2
    Development on integrated passive devices using wafer level package technologies

    Development on integrated passive devices using wafer level package technologies by Byeung-Gee Kim, Yun-Mook Park, Jun-Kyu Lee, In-Soo Kang

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  3. 3
    3D SiP module using TSV and novel solder bump maker

    3D SiP module using TSV and novel solder bump maker by Hyun-Cheol Bae, Kwang-Seong Choi, Yong-Sung Eom, Byeong-Ok Lim, Ki-Jun Sung, Sunghae Jung, Byeung-Gee Kim, In-Soo Kang, Jong-Tae Moon

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  4. 4
    The Reliability of 30 μm pitch COG joints fabricated using Sn/Cu bumps and non-conductive adhesive

    The Reliability of 30 μm pitch COG joints fabricated using Sn/Cu bumps and non-conductive adhesive by Byeung-Gee Kim, Sang-Mok Lee, Young-Ho Kim

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