Search Results - Byung-Yul Min

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  1. 1
    A study on the reliability of stencil printed solder bumps

    A study on the reliability of stencil printed solder bumps by Ho-Cheol Jang, Chul-Won Jee, Young-Ho Kim, In-Bae Park, Sung-Min Seo, Byung-Yul Min

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  2. 2
    Intermetallic formation in the Sn-Ag solder joints between Au stud bumps and Cu pads and its effect on the chip shear strength

    Intermetallic formation in the Sn-Ag solder joints between Au stud bumps and Cu pads and its effect on the chip shear strength by Mu-Seob Shin, Young-Ho Kim

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