Search Results - CANUMALLA, Sridhar

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  1. 1
    Resolution of broadband transducers in acoustic microscopy of encapsulated ICs: transducer selection

    Resolution of broadband transducers in acoustic microscopy of encapsulated ICs: transducer selection by Canumalla, S.

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  2. 2
    Robust Design of Third-Level Packaging in Portable Electronics: Solder Joint Reliability Under Dynamic Mechanical Loading

    Robust Design of Third-Level Packaging in Portable Electronics: Solder Joint Reliability Under Dynamic Mechanical Loading by Canumalla, S.

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  3. 3
    Thermal fatigue behavior of squeeze cast, discontinuous alumina-silicate fiber-reinforced aluminum alloy (A356) composite

    Thermal fatigue behavior of squeeze cast, discontinuous alumina-silicate fiber-reinforced aluminum alloy (A356) composite by Herr, Alan E., Canumalla, Sridhar, Pangborn, Robert N.

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  4. 4
    Thin layer acoustic image interpretation and metrology for microelectronics using a broadband model

    Thin layer acoustic image interpretation and metrology for microelectronics using a broadband model by Canumalla, S.

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  5. 5
    Acoustic emission for in situ monitoring in metal-matrix composite processing

    Acoustic emission for in situ monitoring in metal-matrix composite processing by Canumalla, Sridhar, Pangborn, R.N., Tittmann, B.R., Conway, J.C.

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  6. 6
    Robust design of third level packaging in portable electronics: Solder joint reliability under dynamic mechanical loading

    Robust design of third level packaging in portable electronics: Solder joint reliability under dynamic mechanical loading by Canumalla, S.

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  7. 7
    Package to board interconnection shear strength (PBISS): effect of surface finish, PWB build-up layer and chip scale package structure

    Package to board interconnection shear strength (PBISS): effect of surface finish, PWB build-up layer and chip scale package structure by Canumalla, S., Hee-Dong Yang, Viswanadham, P., Reinikainen, T.O.

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  8. 8
    Intermetallic morphology and damage evolution under thermomechanical fatigue of lead (Pb)-free solder interconnections

    Intermetallic morphology and damage evolution under thermomechanical fatigue of lead (Pb)-free solder interconnections by DUNFORD, Steven, CANUMALLA, Sridhar, VISWANADHAM, Puligandla

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  9. 9
    Mechanical Behavior of Mullite Fiber Reinforced Aluminum Alloy Composites

    Mechanical Behavior of Mullite Fiber Reinforced Aluminum Alloy Composites by Canumalla, Sridhar, Dynan, S. A., Green, D. J., Bhagat, R. B., Pangborn, R. N.

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  10. 10
    Critical issues in thin layer acoustic image interpretation and metrology for microelectronics

    Critical issues in thin layer acoustic image interpretation and metrology for microelectronics by Canumalla, S.

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  11. 11
    Package to board interconnection shear strength (PBISS) behavior at high strain rates approaching mechanical drop

    Package to board interconnection shear strength (PBISS) behavior at high strain rates approaching mechanical drop by HANABE, Murali, CANUMALLA, Sridhar

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  12. 12
    Enhancing drop test efficacy for product quality improvement through interconnection shear tests

    Enhancing drop test efficacy for product quality improvement through interconnection shear tests by Hanabe, M., Canumalla, S., Kujala, A.

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  13. 13
    Effect of intermetallic phases on performance in a mechanical drop environment : 96.5Sn3.5Ag solder on Cu and Ni/Au pad finishes

    Effect of intermetallic phases on performance in a mechanical drop environment : 96.5Sn3.5Ag solder on Cu and Ni/Au pad finishes by SAHA, Sambit K, MATHEW, Sesil, CANUMALLA, Sridhar

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  14. 14
    In situ elastic property characterization of flip-chip underfills

    In situ elastic property characterization of flip-chip underfills by Canumalla, S., Oravecz, M.G.

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  15. 15
    Metrology of thin layers in IC packages using an acoustic microprobe: bondline thickness

    Metrology of thin layers in IC packages using an acoustic microprobe: bondline thickness by Canumalla, S., Schackmuth, B.P.

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  16. 16
    Resolution and signal loss in acoustic microscopy of encapsulated IC packages

    Resolution and signal loss in acoustic microscopy of encapsulated IC packages by Canumalla, S., Oravecz, M.G., Kessler, L.W.

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